The IEEE EPS Packaging Benchmark Suite


The remarkable advances in computational science and engineering (CSE) fueled in part by the persistent increases in the capabilities of computer hardware and software have produced a large and expanding set of computational methods to quantify the electrical performance of electronic packages. Methods such as FEM, MoM, PEEC, FDTD etc. are available through various commercial, academic, freeware, and proprietary simulation tools and continue to be developed, refined, marketed, and applied to the electromagnetic analysis and design of packages.  While these tools advance, the expectations from these simulation tools continue to escalate partly because the requirements from and complexity of electronic packages continue to increase.  Recognizing 

the importance of simulation tools and computational methods to the development of electronic packages,

the necessity of verification, validation, and objective comparison to the proper use and further advancement of these tools and methods, 

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