Co-Design for Chiplets at EPEPS 2022
The special session “Co-Design for Chiplets” was held during the 31st Conference on Electrical Performance of Electronic Packaging and Systems at the San Jose Marriot Hotel on October 10, 2022.
Heterogeneous integration (HI) is bringing a revolutionary change rather than an evolutionary one. The electronic design automation (EDA) will need to undergo transformational changes to manage these new challenges and simple incremental changes to their existing infrastructure may not be sufficient. To address these concerns and others related to HI, several visionaries from industry presented their perspectives at the panel session.
Prith Banerjee, chief technology officer at Ansys, presented his talk entitled “Future of Simulation Driven Innovation in Nanotechnology”.