2017 UCLA CHIPS Workshop Agenda Including HIR Workshop

2017 UCLA CHIPS Workshop Agenda - Wednesday, November 1 , 2017

Time

Event Description 

8:30am to 9:30am

Registration / Breakfast

9:30am to 10:00am

Introduction / Opening Remarks

Subramanian Iyer - UCLA

Greg Pottie - UCLA

Harold Monbouquette - Associate Dean, UCLA

Session 1 Chair: Dwight Streit - UCLA

10:00am to 10:30am

Keynote 1 - "WLSI technologies for Heterogeneous Integration"

Chuei-Tang Wang - TSMC

10:30am to 11:00am

Keynote 2 - "Heterogeneous Integration Roadmap – Global Collaboration"

William Chen - ASE

Panel Discussion Chair: Adeel Bajwa - Postdoctoral Scholar, UCLA ECE

11:00am to 12:00pm

"Heterogeneous Integration Roadmap"

Andrew Kahng - UCSD

Meyya Meyyapan - NASA

Ravi Mahajan - Intel Corporation

Timothy Lee - Boeing

William Chen - ASE

Daniel Green - DARPA

12:00pm to 1:00pm

Lunch + Poster Session

Session 2 Chair: Puneet Gupta - UCLA

1:00pm to 1:30pm

Keynote 3 - "Semiconductor Outlook: A Connected World and Changes in the Packaging Landscape"

Daniel Tracy - SEMI

1:30pm to 2:00pm

Keynote 4 - "DARPA’s Role in Heterogeneous Integration"

Daniel Green - DARPA

Session 3 Chair: Sudhakar Pamarti - UCLA

2:00pm to 2:30pm

Keynote 5 - "Supply Chain Integrity for Heterogeneous Integration"

Srinivasa Banna - GlobalFoundries

2:30pm to 3:30pm

CHIPS Report

Subramanian Iyer - UCLA

Poster Session Chair: Matthew Putman - CEO, Nanotronics

3:30pm to 6:00pm

Poster Session + Social Mixer hosted by Nanotronics

Section 1: Heterogeneous Integration Platforms

Silicon Interconnect Fabric Technology

SivaChandra Jangam - UCLA

Deep Silicon Etching for Through Wafer Via (TWV) and Plasma Dicing (PD) on Si Interconnect Fabric

Yandong Luo - UCLA

Reliability Evaluation of Silicon Interconnect Fabric Technology

Kannan K.T. - UCLA

Performance Scaling using Packageless Systems on Si-IF

Saptadeep Pal - UCLA

Effect of Stress Buffer Layers on Buckling Reduction of Cu Interconnects on Elastomeric Substrates

Randall Irwin - UCLA

Process Optimization for Fine Pitch Interconnects on FlexTrateTM using FOWLP

Arsalan Alam - UCLA

Section 2: Neuromorphic Computing

Deep Learning for Medical Image Segmentation Facilitated by Neuromorphic Hardware

Steven Moran - UCLA

Neuromorphic Computing Featuring Charge-Trap Transistors as Analog Synapses

Xuefeng Gu - UCLA

Three-Dimensional Wafer-Scale Integration for Ultra-Large-Scale Neuromorphic Systems

Zhe (Frank) Wan - UCLA

Spine Segmentation using a Sequence of Convolutional Neural Networks

William Whitehead - UCLA

Section 3: Power and Thermal Management

Power Distribution in Silicon Interconnect Fabric

Premsagar Kittur - UCLA

Adaptive Power Management for Guardband Reduction in Multicore SoC Designs

Samantak Gangopadhyay - Georgia Tech

Thermal Conduction and Convection Technologies for Cooling of Advanced Electronics

Ujash Shah - UCLA

Section 4: Passives and RF Integration

High Density Integrated Passives for SuperCHIPS Application

Goutham Ezhilarasu - UCLA

Low-loss RF Heterogeneous Integration within Si-IF

Partia Naghibi - UCLA

Overcoming Chu's Limit through Switched Electrically Small Antennas using Direct Antenna Modulation

Jean Paul Santos - UCLA

Section 5: Radiation Effects and Detection

Radiation Effects in Advanced Systems

Rachel Brewer - Vanderbilt University

Synthesis and Study of ZnO:Ga Films for Application as Scintillator for Radiation Detection

Karla Cervantes - Benemerita Universidad Autónoma de Puebla, Puebla, Mexico