HIR Workshop at Binghamtom Electronics Packaging Symposium

The HIR workshop was held on Sept 19 afternoon and was part of the 2018 GE / BU Electronics Packaging Symposium. The attendees for the workshop were a mix of academics and industry, with many from Binghamton University, IBM, GE, Lockheed Martin and BAE Systems. The keynote for the workshop was given by Rozalia Beica from Dow, this was followed by presentations from the following Technical Working Groups: 2.5D / 3D Packaging, Medical / Health / Wearable, Single / Multi Chip Packages, Aerospace / Defense, Thermal, Wafer Level Fan-Out and High Performance Computing. 


 Binghamton photo