IEEE EPS Malaysia: 2019 Semiconductor Advanced Packaging Workshop

The 2019 Semiconductor Advanced Packaging Workshop organized by IEEE EPS Malaysia Chapter is back! The bi-annual one-day technical workshop took place at Eastin Hotel, Penang and New World Hotel, Petaling Jaya scheduled on September 24th and 25th respectively. It featured contemporary packaging trends and development of emerging technologies from two distinguished speakers in the field of semiconductor: (1) Prof. Dr. Madhavan Swaminathan (Georgia Tech, USA) on “Intelligent Digital Convergence for AI and 5G” (2) Dr. John Lau Hon Shing (UMTC, Taiwan) on “Fan-Out Wafer/Panel-Level Packaging & Heterogeneous Integrations (SiPs)”.


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