HIR Workshop at IMAPS 2019

The Heterogeneous Integration Roadmap (HIR) held a Workshop at IMAPS International Symposium on Microelectronics in Boston, MA, the largest IMAPS annual conference. The HIR workshop was very well attended with standing room only at the back of the conference room. The workshop session chaired by Urmi Ray (consultant) & V. Mathew (NXP), includes HIR roadmap overview, followed by presentations from four Technical Working Groups.    


Heterogeneous Integration Roadmap Overview        William Chen (ASE)
SiP & Module                                                              Andreas Grassmann (Infinion)
High Performance Computing & Data Center            Dale Becker (IBM)
Mobile                                                                         Benson Chan (Binghamton University)
Wafer Level Packaging (WLP) Fan-in & Fan-out       John Hunt (ASE)


The next HIR Workshops will be held at IMPACT in Taiwan (October 23 – 25) and EPTC in Singapore (December 4-6).

We look forward to seeing you at one of the upcoming HIR workshops.