The Heterogeneous Integration Roadmap (HIR) held a Workshop at IMAPS International Symposium on Microelectronics in Boston, MA, the largest IMAPS annual conference. The HIR workshop was very well attended with standing room only at the back of the conference room. The workshop session chaired by Urmi Ray (consultant) & V. Mathew (NXP), includes HIR roadmap overview, followed by presentations from four Technical Working Groups.
Heterogeneous Integration Roadmap Overview William Chen (ASE)
SiP & Module
High Performance Computing & Data Center Dale Becker (IBM)
Wafer Level Packaging (WLP) Fan-in & Fan-out John Hunt (ASE)
We look forward to seeing you at one of the upcoming HIR workshops.