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Submit your abstract for the 71st ECTC! 
The premier international packaging, components, and microelectronics systems technology conference

 You are invited to submit an abstract proposal about new developments and technology related to the following:

· Applied Reliability

· Assembly and Manufacturing Technology

· Emerging Technologies

· RF, High-Speed Components & Systems

· Interconnections

· Materials and Processing

· Packaging Technologies

· Photonics

· Thermal/Mechanical Simulation and Characterization

· Interactive Presentations

Submission Guidelines

The content must be original, previously unpublished, non-confidential and without commercial content.

All abstracts and proposals must be submitted electronically at our website by 18 October 2020. Get more details here. Selected authors and instructors will be announced by 11 December 2020. The first 100 people to submit abstracts will be entered into a drawing to win a free ECTC 2021 registration.

For a limited time, the best papers and Dick Chu Award paper from ITherm 2020 will be available as open access.

“Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits”

Remco van Erp, Georgios Kampitsis, Luca Nela, Reza Soleimanzadeh Ardebili, Elison Matioli

 

“General Thermosyphon Simulation Code for Electronics Cooling Applications”

Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome

 

“Modelling Indium Interconnects for Ultra Fine-Pitch Focal Plane Arrays”

Stoyan Stoyanov, Chris Bailey, Rhys Waite, Christopher Hicks, Terry Golding

 

“Additively Manufacturing Nitinol as a Solid-State Phase Change Material”

Darin J. Sharar, Adam A. Wilson, Asher Leff,  Andrew Smith, K. Can Atli, Alaa Elwany,  Raymundo Arroyave, Ibrahim Karaman

 

Dick Chu Paper Award

“Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration”

Ravi Mahajan

As the organizing team, we are excited to invite you to register for this new EPS symposium. It features eminent Keynote talks and presentations in the evolving and exciting field of Electronics and Photonics packaging.  This 2-day virtual event will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic and photonic assemblies, packages and systems. This includes failure modes, mechanisms, design, simulation and accelerated testing.

   

This Symposium is organized by the Photonics and Reliability technical committees of EPS, and sponsored by the IEEE Santa Clara Valley Chapter, to galvanize an increased conversation on reliability of electronics and photonics integration. 

 

Download the Advance Program for the symposium from the website, at attend.ieee.org/repp. Kindly sign up for our Dlist herefor continuing updates. 

 

Dates:  Nov. 12-13, 2020

 

Location: Online event, links to the event will be sent after registration.

 

Gnyan Ramakrishna, Chair, EPS TC-Photonics, and Richard Rao, Chair, EPS TC-Reliability 

The  IEEE  Electrical  Design  of  Advanced  Packaging  and  Systems  (EDAPS)  Symposium  is  the  premier  international  conference  in  Asia‐Pacific  region  to  share  the  recent  progress  of  design,  modeling,  simulation  and  measurement  related to the electrical issues arising at the chip, package and system levels. Covering the paper presentations, industry  exhibitions,  workshops  and  tutorials,  the  EDAPS  2020  will  be  held  virtually  from  December  14  to  16,  2020.  The  technical program of the symposium not only addresses the current technical issues but also brings out the topics on  IC design, SiP/SoP packaging, EMI/EMC, EDA tools and most importantly the challenge issues in advanced 3D‐IC and  TSV design. For further information, please visit the website at to edaps.org.

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Title: Overview of the Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap

Date: October 21, 2020

Time: 11:00 AM EDT

Presenter: Jeff Demmin

Register Here

Abstract:

The Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap addresses the specific challenges of A&D electronics, including long product lifecycles, low volumes, demanding environments, security, and extreme performance requirements.  This webinar will review the landscape to A&D heterogeneous integration from the inaugural 2019 edition, as well as the high-level roadmap table being rolled out in the 2020 update.

Bio:

Jeff Demmin is the Semiconductor and Defense Project Manager at Keysight Technologies in Santa Rosa, CA.  Previously he was a Senior Lead Scientist at Booz Allen Hamilton, where he worked on heterogeneous integration programs for DARPA and other government clients. Before that, he was with STATS ChipPAC, and he worked for over a decade at Tessera in corporate development and IP acquisition.  His career started in semiconductor package design at National Semiconductor, and he has also served as the Editor-in-Chief of Advanced Packaging magazine.  He has a Bachelor’s degree in Physics from Princeton and a Master’s degree in Materials Science from Stanford.  He has been in the industry long enough that all of his patents have expired.

Download HIR Chapter 6 Aerospace & Defense

Title: Integrated Power - A Virtual Panel Session

Date: October 22, 2020

Time: 4:30 - 6:30 PM PDT

Register Here

Abstract: 

Power Systems on Chip (PSoC) have evolved significantly over the past decade or two and have made inroads into mass production.  Between integrated magnetics and switched-capacitor ICs, there are many options for integrated power available today.  Solutions have been used in mass-market cell phones, telecommunications hardware and more.

Our speakers will discuss specific technologies they’ve developed to help miniaturize power supplies and push higher power density. We will then have a discussion comparing and contrasting the technologies, and field questions about how they can be used in applications.

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The EPS Awards Program recognizes contributions to the profession, industry and the Society through a comprehensive set of awards and recognitions.

EPS Major Awards

A series of EPS Major Awards, recognizing technical contributions and service, is administered by the EPS Awards Committee:

·       Outstanding Sustained Technical Contribution Award

·       Electronics Manufacturing Technology Award

·       David Feldman Outstanding Contribution Award

·       Exceptional Technical Achievement Award

·       Outstanding Young Engineer Award

·       Regional Contributions Award

 

 Nomination Period September 15, 2020- January 25, 2021

Description/Objective:

To promote, recognize, and support PhD level study and research within the Electronics Packaging Society’s field of interest.

Prize: 

A plaque and a single annual award of US$5,000, applicable towards the student’s research.

Eligibility:

Candidate must be an IEEE EPS member, at the time of nomination, and be pursuing a doctorate degree within the EPS field of interest on a full-time basis from an accredited graduate school or institution.The candidate must have studied with her/his advisor for at least 1 year, at the time of nomination, to be eligible. A Student who received a Fellowship award from another IEEE Society, within the same year, or is a previous EPS Fellowship winner is ineligible.

Nomination Period September 15, 2020 - January 25, 2021

Nomination Form

Benson Chan, Emerging Technologies Technical Committee Chair

The following are fifteen recent Binghamton University’s Integrated Electronics Engineering Center (IEEC) “Flashes” that pertain to emerging technologies in electronic packaging. These Flashes are published by the IEEC monthly and is meant to bring the latest news relating to electronics packaging. If you are interested in reading more about these news briefs, the titles have hyperlinks to the source articles.

Shrunken nanolasers enable on-chip optical connections

Researchers from the Moscow Institute of Physics and Technology cleared the obstacle that had prevented the creation of electrically driven nanolasers for ICs. The approach enables a coherent light source design on the scale  smaller than the wavelength of light emitted by the laser. This enables ultrafast optical data transfer in microprocessors. The proposed new scheme for electrical pumping is based on a double heterostructure with a tunneling Schottky contact. It makes the ohmic contact with its strongly absorbing metal redundant. The pumping now happens across the interface between the plasmonic metal and semiconductor, along which SPPs propagate.

Electronics cooling using additive manufacturing

 

Researchers from the University of Illinois have developed a new type of air jet cooler that overcomes previous barriers to jet cooling systems. Using additive manufacturing, they created an air jet cooling system in a single component that can direct high-speed air onto multiple electronics hot spots. They manufactured the cooling system using polymer materials that can withstand the harsh conditions associated with high-speed air jets (200 mph). The research focused on heat removal from high-power electronic devices in a host of applications including electric vehicles, aircraft, and automotive.

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P M Raj, Florida International University, Miami, Nanotechnology Technical Committee Chair

The primary mission of Nanopackaging TC is to promote nanotechnologies to packaging community and accelerate their adoption by disseminating the knowledge through conferences, webinars, industry-academia interactions, IEEE web portals, newsletters and other means. The final goal is to create synergistic research ecosystems to solve the technical barriers and enable future electronics. The recent conferences, IEEE NANO and ECTC brought several key advances in nanopackagingt to limelight. This newsletter highlights those advances and also provides details about upcoming IEEE NMDC 2021 and upcoming IEEE International Electronics Week in Europe.

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