Submit your abstract for the 71st ECTC!
The premier international packaging, components, and microelectronics systems technology conference
The content must be original, previously unpublished, non-confidential and without commercial content.
All abstracts and proposals must be submitted electronically at our website by 18 October 2020. Get more details here. Selected authors and instructors will be announced by 11 December 2020. The first 100 people to submit abstracts will be entered into a drawing to win a free ECTC 2021 registration.
For a limited time, the best papers and Dick Chu Award paper from ITherm 2020 will be available as open access.
Remco van Erp, Georgios Kampitsis, Luca Nela, Reza Soleimanzadeh Ardebili, Elison Matioli
Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome
Stoyan Stoyanov, Chris Bailey, Rhys Waite, Christopher Hicks, Terry Golding
Darin J. Sharar, Adam A. Wilson, Asher Leff, Andrew Smith, K. Can Atli, Alaa Elwany, Raymundo Arroyave, Ibrahim Karaman
Dick Chu Paper Award
As the organizing team, we are excited to invite you to register for this new EPS symposium. It features eminent Keynote talks and presentations in the evolving and exciting field of Electronics and Photonics packaging. This 2-day virtual event will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic and photonic assemblies, packages and systems. This includes failure modes, mechanisms, design, simulation and accelerated testing.
to galvanize an increased conversation on reliability of electronics and photonics integration.
Gnyan Ramakrishna, Chair, EPS TC-Photonics, and Richard Rao, Chair, EPS TC-Reliability
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia‐Pacific region to share the recent progress of design, modeling, simulation and measurement related to the electrical issues arising at the chip, package and system levels. Covering the paper presentations, industry exhibitions, workshops and tutorials, the EDAPS 2020 will be held virtually from December 14 to 16, 2020. The technical program of the symposium not only addresses the current technical issues but also brings out the topics on IC design, SiP/SoP packaging, EMI/EMC, EDA tools and most importantly the challenge issues in advanced 3D‐IC and TSV design. For further information, please visit the website at to edaps.org.
Title: Overview of the Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap
Date: October 21, 2020
Time: 11:00 AM EDT
Presenter: Jeff Demmin
The Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap addresses the specific challenges of A&D electronics, including long product lifecycles, low volumes, demanding environments, security, and extreme performance requirements. This webinar will review the landscape to A&D heterogeneous integration from the inaugural 2019 edition, as well as the high-level roadmap table being rolled out in the 2020 update.
Jeff Demmin is the Semiconductor and Defense Project Manager at Keysight Technologies in Santa Rosa, CA. Previously he was a Senior Lead Scientist at Booz Allen Hamilton, where he worked on heterogeneous integration programs for DARPA and other government clients. Before that, he was with STATS ChipPAC, and he worked for over a decade at Tessera in corporate development and IP acquisition. His career started in semiconductor package design at National Semiconductor, and he has also served as the Editor-in-Chief of Advanced Packaging magazine. He has a Bachelor’s degree in Physics from Princeton and a Master’s degree in Materials Science from Stanford. He has been in the industry long enough that all of his patents have expired.
Title: Integrated Power - A Virtual Panel Session
Date: October 22, 2020
Time: 4:30 - 6:30 PM PDT
Power Systems on Chip (PSoC) have evolved significantly over the past decade or two and have made inroads into mass production. Between integrated magnetics and switched-capacitor ICs, there are many options for integrated power available today. Solutions have been used in mass-market cell phones, telecommunications hardware and more.
Our speakers will discuss specific technologies they’ve developed to help miniaturize power supplies and push higher power density. We will then have a discussion comparing and contrasting the technologies, and field questions about how they can be used in applications.
The EPS Awards Program recognizes contributions to the profession, industry and the Society through a comprehensive set of awards and recognitions.
EPS Major Awards
A series of EPS Major Awards, recognizing technical contributions and service, is administered by the EPS Awards Committee:
Nomination Period September 15, 2020- January 25, 2021
To promote, recognize, and support PhD level study and research within the Electronics Packaging Society’s field of interest.
A plaque and a single annual award of US$5,000, applicable towards the student’s research.
Candidate must be an IEEE EPS member, at the time of nomination, and be pursuing a doctorate degree within the EPS field of interest on a full-time basis from an accredited graduate school or institution.The candidate must have studied with her/his advisor for at least 1 year, at the time of nomination, to be eligible. A Student who received a Fellowship award from another IEEE Society, within the same year, or is a previous EPS Fellowship winner is ineligible.
Nomination Period September 15, 2020 - January 25, 2021
Benson Chan, Emerging Technologies Technical Committee Chair
The following are fifteen recent Binghamton University’s Integrated Electronics Engineering Center (IEEC) “Flashes” that pertain to emerging technologies in electronic packaging. These Flashes are published by the IEEC monthly and is meant to bring the latest news relating to electronics packaging. If you are interested in reading more about these news briefs, the titles have hyperlinks to the source articles.
Shrunken nanolasers enable on-chip optical connections
Researchers from the Moscow Institute of Physics and Technology cleared the obstacle that had prevented the creation of electrically driven nanolasers for ICs. The approach enables a coherent light source design on the scale smaller than the wavelength of light emitted by the laser. This enables ultrafast optical data transfer in microprocessors. The proposed new scheme for electrical pumping is based on a double heterostructure with a tunneling Schottky contact. It makes the ohmic contact with its strongly absorbing metal redundant. The pumping now happens across the interface between the plasmonic metal and semiconductor, along which SPPs propagate.
Electronics cooling using additive manufacturing
Researchers from the University of Illinois have developed a new type of air jet cooler that overcomes previous barriers to jet cooling systems. Using additive manufacturing, they created an air jet cooling system in a single component that can direct high-speed air onto multiple electronics hot spots. They manufactured the cooling system using polymer materials that can withstand the harsh conditions associated with high-speed air jets (200 mph). The research focused on heat removal from high-power electronic devices in a host of applications including electric vehicles, aircraft, and automotive.
P M Raj, Florida International University, Miami, Nanotechnology Technical Committee Chair
The primary mission of Nanopackaging TC is to promote nanotechnologies to packaging community and accelerate their adoption by disseminating the knowledge through conferences, webinars, industry-academia interactions, IEEE web portals, newsletters and other means. The final goal is to create synergistic research ecosystems to solve the technical barriers and enable future electronics. The recent conferences, IEEE NANO and ECTC brought several key advances in nanopackagingt to limelight. This newsletter highlights those advances and also provides details about upcoming IEEE NMDC 2021 and upcoming IEEE International Electronics Week in Europe.