Title: Overview of the Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap
Date: October 21, 2020
Time: 11:00 AM EDT
Presenter: Jeff Demmin
The Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap addresses the specific challenges of A&D electronics, including long product lifecycles, low volumes, demanding environments, security, and extreme performance requirements. This webinar will review the landscape to A&D heterogeneous integration from the inaugural 2019 edition, as well as the high-level roadmap table being rolled out in the 2020 update.
Jeff Demmin is the Semiconductor and Defense Project Manager at Keysight Technologies in Santa Rosa, CA. Previously he was a Senior Lead Scientist at Booz Allen Hamilton, where he worked on heterogeneous integration programs for DARPA and other government clients. Before that, he was with STATS ChipPAC, and he worked for over a decade at Tessera in corporate development and IP acquisition. His career started in semiconductor package design at National Semiconductor, and he has also served as the Editor-in-Chief of Advanced Packaging magazine. He has a Bachelor’s degree in Physics from Princeton and a Master’s degree in Materials Science from Stanford. He has been in the industry long enough that all of his patents have expired.