IEEE Electronics Packaging Society IEEE Electronics Packaging Society

ECTC 2021 Abstract Submission Extended to October 18th

Submit your abstract for the 71st ECTC! 
The premier international packaging, components, and microelectronics systems technology conference

 You are invited to submit an abstract proposal about new developments and technology related to the following:

· Applied Reliability

· Assembly and Manufacturing Technology

· Emerging Technologies

· RF, High-Speed Components & Systems

· Interconnections

· Materials and Processing

· Packaging Technologies

· Photonics

· Thermal/Mechanical Simulation and Characterization

· Interactive Presentations

Submission Guidelines

The content must be original, previously unpublished, non-confidential and without commercial content.

All abstracts and proposals must be submitted electronically at our website by 18 October 2020. Get more details here. Selected authors and instructors will be announced by 11 December 2020. The first 100 people to submit abstracts will be entered into a drawing to win a free ECTC 2021 registration.