Symposium on Reliability for Electronics and Photonics Packaging (IEEE- REPP) : Register Now
As the organizing team, we are excited to invite you to register for this new EPS symposium. It features eminent Keynote talks and presentations in the evolving and exciting field of Electronics and Photonics packaging. This 2-day virtual event will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic and photonic assemblies, packages and systems. This includes failure modes, mechanisms, design, simulation and accelerated testing.
to galvanize an increased conversation on reliability of electronics and photonics integration.
Gnyan Ramakrishna, Chair, EPS TC-Photonics, and Richard Rao, Chair, EPS TC-Reliability