Symposium on Reliability for Electronics and Photonics Packaging (IEEE- REPP) : Register Now

As the organizing team, we are excited to invite you to register for this new EPS symposium. It features eminent Keynote talks and presentations in the evolving and exciting field of Electronics and Photonics packaging.  This 2-day virtual event will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic and photonic assemblies, packages and systems. This includes failure modes, mechanisms, design, simulation and accelerated testing.


This Symposium is organized by the Photonics and Reliability technical committees of EPS, and sponsored by the IEEE Santa Clara Valley Chapter, to galvanize an increased conversation on reliability of electronics and photonics integration. 


Download the Advance Program for the symposium from the website, at Kindly sign up for our Dlist herefor continuing updates. 


Dates:  Nov. 12-13, 2020


Location: Online event, links to the event will be sent after registration.


Gnyan Ramakrishna, Chair, EPS TC-Photonics, and Richard Rao, Chair, EPS TC-Reliability