EDAPS 2020 Call for Papers

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia‐Pacific region to share the recent progress of design, modeling, simulation and measurement related to the electrical issues arising at the chip, package and system levels. Covering the paper presentations, industry exhibitions, workshops and tutorials, the EDAPS 2020 will be held virtually from December 14 to 16, 2020. The technical program of the symposium not only addresses the current technical issues but also brings out the topics on IC design, SiP/SoP packaging, EMI/EMC, EDA tools and most importantly the challenge issues in advanced 3D‐IC and TSV design. For further information, please visit the website at to edaps.org.