Upcoming IEEE EPS France Webinar
Title: Fan Out Packaging and its Diversity
Date: Tuesday, November 30, 2021
Time: 4:30 PM (UTC+01:00) Brussels, Copenhagen, Madrid, Paris
Presenter: John Hunt - Senior Director, Engineering Marketing & Technical Promotion ASE (US) Inc.
Abstract: Fan Out technology has evolved in recent years as an alternative package answering a growing need for miniaturization in electronics, while also providing improved electrical interconnectivity for more advanced multi-die solutions. This has been accomplished through the integration of a wide variety of wafer and panel level technologies, processes and materials. Fan out has enabled both the miniaturization of low-end packages for mobile applications, as well as the interconnection required for more advanced complex package assemblies. We will review these Fan Out technologies, including Wafer Level Fanout, Panel Level Fanout, and multiple combinations of chip first and chip last solutions. The resulting packaging combinations that evolve from these technologies will only be limited by our imaginations, and our creativity in innovating them.
To register: send an email to jean-charles.souriau@cea.fr
Open to Everyone!