Symposium on Reliability for Electronics and Photonics Packaging (IEEE- REPP) : Register NOW
As the organizing team, we are excited to invite you to register for the EPS second symposium of REPP. It features eminent Plenary talks , invited talks and presentations in the evolving and exciting field of Electronics and Photonics packaging and the program details can be reviewed through this link.
This 2-day virtual event will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic and photonic assemblies, packages and systems. This includes failure modes, mechanisms, design, simulation and accelerated testing.
Kindly sign up for our Dlist herefor continuing updates.
From The Organizing Committee