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VOTE

Election of EPS Members at Large continues through October 18, 2022

Election Principles 

The EPS Board of Governors (BoG) includes 19 Members-at-Large, elected by the full voting membership of the Society. Six Members at Large will be selected each year to represent the regional composition of the Society membership and one Member at Large will be selected to represent the Young Professional community. A Young Professional is an individual that has completed their first academic degree within the last 15 years.

Regional Members-at-Large are elected to achieve totals proportionate to the geographic distribution of EPS members. Any IEEE Region/grouping of Regions determined to have at least 10% of total EPS members will have the proportional number of Member-at-Large positions designated to it for representation on the BoG.  The slate of candidates for each year’s election will be constructed to ensure that the resulting total of newly elected Members-at-Large and continuing Members-at-Large, respectively, has the proper proportion of representatives from each Region/grouping of Regions. Each Region/grouping of Regions will have a separate slate of candidates from that Region. Voting members will elect members-at-large from within their Region only (that is, members in Region 8 vote for Members-at-Large from Region 8, members in Region 10 vote for Members-at-Large from Region 10; etc.). There is no election of a Young Professional this year.

With renewal of your 2023 membership, EPS members will have access to the new EPS Digital Library!

This will include unlimited access, via Xplore, to the Transactions on Components, Packaging and Manufacturing Technology (T-CPMT) and earlier Transactions, and proceedings for EPS sponsored conferences from the current year to the early nineties,  including ECTC, ESTC, ITherm and more!

Multile Society discount Program

 Hi there!

Did You Know that as an IEEE EPS member you can take advantage of the IEEE - New: Join Multiple IEEE Societies & Save 5% program to connect across several IEEE Societies.

This enables you to expand your technical network and collaborate on the latest cutting-edge technical research, policy, and innovation at a "discount" when you become a member or renew your membership of two or more participating IEEE Societies. Below are IEEE societies that you may what to consider that definitely complement your EPS membership: 

IEEE Microwave Theory & Techniques (MTT)

IEEE Solid State CIrcuit Society (SSCS)

IEEE Electron Devices (EDS)

IEEE Power Electronic Society (PELS)

IEEE Photonics Society (PHO)

If you’re already a member of two or more participating IEEE Societies, the discount will automatically be applied when you renew. If you’ve always been interested in a complementary IEEE Society, this program provides you with the opportunity to join at a discounted rate. 

Hope to see you in this expanded network across IEEE!!

Warm regards,

Kitty

EPS President

EPS Resource Center graphic

EPS members:

Access conference materials, webinars, and more resources through the EPS Resource Center, for low or no-cost!

Content covers all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing

components and more. https://resourcecenter.eps.ieee.org/

Genaro Soto-Valle, Charles A. Lynch III, Manos M. Tentzeris

I. Introduction

In recent years, the tremendous growth in the demand for consumer electronics combined with the advances in the area of millimeter-waves (mmWave) has enabled great improvement in the field of Internet of Things (IoT), which is consequently paving the way for our societies to make the idea of Smart Cities possible. Some applications that lie under the ‘Smart Cities’ scope include structural health monitoring, ubiquitous biochemical and health monitoring, positioning and localization applications, as well as low-cost energy harvesting devices. In addition, the realm of virtual reality (VR) has also drawn tremendous attention among regular consumers, increasing the need for improving our current technologies related to digital twins in order to map physical objects into the digital world.

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IEEE EDAPS (Electrical Design of Advanced Packaging and Systems) is pleased to announce its 1st International Mini-Workshop on Emerging Trends in Semiconductor Integrated Circuit (IC) Packaging.

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium has consistently served as a platform for disseminating the latest research on chip, package, and system electrical design. Designers and researchers worldwide share and discuss their work on all aspects of electrical IC packaging, including modeling, design and simulation, fabrication, and characterization. We are excited to host this workshop in IEEE Region 8. This workshop will consist of four invited keynote presentations covering multiple aspects of IC Packaging from experts in academia and industry and invited presentations from EPS Student Chapters/Chapters in Region 8. Your attendance at this event is highly encouraged as it is a forerunner to the highly anticipated EDAPS 2023 Workshop!

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The 3rd IEEE International Conference on Quantum Computing and Engineering (QCE) was held on 9/18-23 in Broomfield, CO (https://qce.quantum.ieee.org/2022/).  QCE bridges the gap between the science of quantum computing and the development of its ecosystem.  After two successful virtual Quantum Week events during the pandemic, this year’s meeting attracted over 1000 attendees (about 700 in-person and 300 virtual).  Besides live exhibits, QCE22 offered 9 Keynote talks, 70 technical papers, 60 posters, 16 workshops, 25 tutorials, 13 panels, and 5 Birds-of-a-Feather sessions.  All the talks were recorded and made available on-demand on the Hubb virtual platform to all the registrants until November 15, 2022.

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The Mid-Hudson Valley EPS Chapter hosted and organized a Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity in August 2022. It was open to all students and professionals, regardless of IEEE or EPS membership status. We invited subject matter experts and technology leaders in the various areas of electronic packaging to educate and inform our audience. A total of 112 individuals registered for this on site in person event at the SUNY CNSE / IBM Research Campus in Albany, New York. 

The event was posted on Vtools, and publicized through various channels, including EPS, IEEE Region 1 announcements, and internally in various organizations and academic institutions, through email. Registration was free to all. The EPS MHV Chapter provided a mid-morning break with coffee, juice, and light refreshments. The attendees gave the chapter accolades in person because of the timely subject matter and the expertise of the speakers.

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The EPS proudly congratulates the inaugural receipent of the IEEE Certificate of Distinguished Achievement for Professional Engagement and Service:

Daniel Donahoe

You can find the most accessed T-CPMT articles on Xplore here