September 2017 - IEEE Electronics Packaging Society
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Automotive Sensor Packaging Trends  DATE: Wednesday, October 18, 2017  11:00 AM EDT

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Presenter: Jan Vardaman

Host: Beth Keser

ABSTRACT:

An increasing number of sensors are used in automotive applications.  Familiar sensors applications include air bags and tire pressure sensors.  New automotive safety features include improved self-diagnostics, crash avoidance technology, and advanced driver assistance.  This translates into increase use of image sensors, LiDAR, and radar.  Multiple combinations of sensors are anticipated.  What types of semiconductor packages are used in these automotive electronics and what are the future challenges as new package types are adopted? This presentation discusses some of the opportunities in automotive packaging and the challenges in meeting automotive specifications. 

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The UCLA Center for Heterogeneous Integration and Performance Scaling is pleased to announce the 2nd UCLA CHIPS Workshop held at the UCLA Campus on Wednesday, November 1, 2017

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Brest, France
Abstract Submission Date: Jan 19, 2018
May 22, 2018 - May 25, 2018
San Diego, CA USA
Abstract Submission Date: Oct 16, 2017
May 29, 2018 - Jun 1, 2018
Dresden, Germany
Abstract Submission Date: Jan 31, 2018
Sep 18, 2018 - Sep 21, 2018