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Automotive Sensor Packaging Trends  DATE: Wednesday, October 18, 2017  11:00 AM EDT

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Presenter: Jan Vardaman

Host: Beth Keser


An increasing number of sensors are used in automotive applications.  Familiar sensors applications include air bags and tire pressure sensors.  New automotive safety features include improved self-diagnostics, crash avoidance technology, and advanced driver assistance.  This translates into increase use of image sensors, LiDAR, and radar.  Multiple combinations of sensors are anticipated.  What types of semiconductor packages are used in these automotive electronics and what are the future challenges as new package types are adopted? This presentation discusses some of the opportunities in automotive packaging and the challenges in meeting automotive specifications. 

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The UCLA Center for Heterogeneous Integration and Performance Scaling is pleased to announce the 2nd UCLA CHIPS Workshop held at the UCLA Campus on Wednesday, November 1, 2017

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