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Election Principles

The EPS Board of Governors (BoG) includes 18 Members-at-Large, elected by the full voting membership of the Society. The three-year terms of the Members-at-Large are staggered -- so that six Members-at-Large to the Board of Governors are elected annually.

Members-at-Large are elected to achieve totals proportionate to the geographic distribution of EPS members. Any IEEE Region/grouping of Regions determined to have at least 10% of total EPS members will have the proportional number of Member-at-Large positions designated to it for representation on the BoG.  The slate of candidates for each year’s election will be constructed to ensure that the resulting total of newly elected Members-at-Large plus continuing Members-at-Large has the proper proportion of representatives from each Region/grouping of Regions.

Each Region/grouping of Regions will have a separate slate of candidates from that Region.  Voting members will elect members-at-large from within their Region only (that is, members in Region 8 vote for Members-at-Large from Region 8, members in Region 10 vote for Members-at-Large from Region 10; etc.)

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The EPS Awards Program recognizes contributions to the profession, industry and the Society through a comprehensive set of awards and recognitions.


EPS Major Awards

A series of EPS Major Awards, recognizing  technical contributions and service, is administered by the EPS Awards Committee:

Nomination Period September 15, 2018 - January 21, 2019

Nomination Form

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To promote, recognize, and support PhD level study and research within the Electronics Packaging Society’s field of interest.

A plaque and a single annual award of US$5,000, applicable towards the student’s research.

Candidate must be an IEEE EPS member, at the time of nomination, and be pursuing a doctorate degree within the EPS field
of interest on a full-time basis from an accredited graduate school or institution.
The candidate must have studied with her/his advisor for at least 1 year, at the time of nomination, to be eligible.
A Student who received a Fellowship award from another IEEE Society, within the same year, or is a previous EPS Fellowship
winner is ineligible.

Nomination Period September 15, 2018 - January 21, 2019

Nomination Form

Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. With the rapid migration of logic, memory and applications to the Cloud infrastructures, Data Centers and 5G Networks, the Internet of Things (IoT) to internet of everything (IOE), Autonomous Vehicles, the proliferation of Smart Devices every where, and increasing interest in 5G, artificial intelligence (AI) & Virtual Reality (VR), the pace of innovation is increasing to meet these challenges. What are the paths forward?

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TCPMT has established itself as a high quality journal reflecting the technical depth and diversity of work happening in Micro-electronics packaging. As Heterogeneous Integration continues to drive the evolution of semi-conductor devices and a systems focus takes hold in this evolution, it is imperative that we continue to grow as a reliable steward and a source of well-rounded information. To ensure this we are making the following changes:

TCPMT has moved to the preprint option. With preprinting, the author-submitted final version will be posted to Xplore within 1-2 days of receiving final source files.

TCPMT will add a Letters Section to the existing journal. Letters will be a maximum of 4 pages in length, printed in smaller font and will focus on providing a quick turn publication option that allows for current work to be available to the community. Details of the implementation will be published in the coming weeks.

Our current average turnaround for a paper is 73 days. We have received the commitment of the AEs to reduce this  average down to 45 days from receipt of the paper to final decision.

A new report has been created for Associate Editors and Guest Editors to get the lastest list of reviewers with keywords for areas of expertise.

If you are interested in becoming a reviewer, please contact the EPS Executive Office – d.manning@ieee.org

The IEEE TryEngineering summer camps were held at three U.S. colleges: the University of California, Riverside; Texas A&M University; and Vaughn College of Aeronautics and Technology, in New York City. A total of 85 students attended the two-week sessions, held in July. Students in Grades 8 to 12 had the opportunity to build smart cars, erect bridges made from spaghetti, design drones, and compete in rocket challenges. TryEngineering awarded scholarships to 15 students who otherwise would not be able to afford a summer camp. One of the five IEEE societies to provide scholarship funds was EPS. 

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Submit an abstract for the 69th IEEE Electronic Components and Technology Conference (ECTC), to be held May 28 –May 31, 2019, at The Cosmopolitan of Las Vegas, Nevada, USA. This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.

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ITherm 2019 will be held along with the 67th Electronic Components and Technology Conference (ECTC 2019 - http://www.ectc.net), a premier electronics packaging conference at The Cosmopolitan of Las Vegas, Las Vegas, NV USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2019 will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.

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5 Most Popular Articles according to Xplore® usage statistics


 3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349 


A Low-Cost and High-Gain 60-GHz Differential Phased Array Antenna in PCB Process

Tao Zhang ; Lianming Li ; Haiyang Xia ; Xujun Ma ; Tie Jun Cui

Publication Year: 2018, Page(s):1281 – 1291

Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland

Publication Year: 2017, Page(s):1891 – 1898

A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Hui Chu ; Yong-Xin Guo

Publication Year: 2017, Page(s):964 – 973

Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Wen Tao Li ; Yong Qiang Hei ; Peter Mack Grubb ; Xiao-Wei Shi ;Ray T. Chen

Publication Year: 2018, Page(s):1 – 7


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