69th ECTC Call for Papers

Submit an abstract for the 69th IEEE Electronic Components and Technology Conference (ECTC), to be held May 28 –May 31, 2019, at The Cosmopolitan of Las Vegas, Nevada, USA. This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.