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Title: New Results on Electromigration Modeling - A departure from Blech's Theory

Date: September 25, 2019

Time: 11:00 AM EDT

Presenter: Xuejun Fan

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Abstract

We have recently developed a multi-physics-based general coupling theory for electromigration (J. Appl. Phys. 125, 105101, 2019). The results show the mechanical stress is significantly less than the existing literature solutions. In addition, the vacancy concentration gradient plays an important role in formulating electromigration problems. We revisited Blech’s theory and a new threshold criterion for electromigration failure has been developed. This is a major departure from the Blech’s theory, and the preliminary results show the predicted results are consistent with the Blech’s original test data.

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We invite you to be among the first to have your article peer-reviewed and published in the new Electronics Packaging section within IEEE Access. This is an exciting opportunity for your research to benefit from the high visibility of IEEE Access. Your work will also be exposed to 5 million unique monthly users of the IEEE Xplore® Digital Library.

The Electronics Packaging Section within IEEE Access will draw on the expert technical community to continue IEEE’s commitment to publishing the most highly-cited content. Our goal is to publish quickly - the rapid peer review process has demonstrated an average submission to publication time of 5.0 weeks for the first 6 months of 2019.  This journal is fully open and compliant with funder mandates, including Plan S.

Scope

The IEEE Electronics Packaging Society section in IEEE Access covers the scientific, engineering, and production aspects of materials, components, modules, hybrids and micro-electronic systems for all electronic applications, which includes technology, selection, modeling/simulation, characterization, assembly, interconnection, packaging, handling, thermal management, reliability, testing/control of the above as applied in design and manufacturing. Examples include optoelectronics and bioelectronic systems packaging, and adaptation for operation in severe/harsh environments. Emphasis is on research, analysis, development, application and manufacturing technology that advance state-of-the-art within this scope.

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Join us at the Heterogeneous Integration Roadmap (HIR) Workshop hosted by the 2019 ASME InterPACK Conference

Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. With the rapid migration of logic, memory and applications to the Cloud infrastructures, Data Centers and 5G Networks, the Internet of Things (IoT) to internet of everything (IOE), Autonomous Vehicles, the proliferation of Smart Devices every where, and increasing interest in artificial intelligence (AI) & Virtual Reality (VR), the pace of innovation is increasing to meet these challenges. What are the paths forward?

There is no cost to attend the HIR workshop only. Click on the blue registration button and pick the HIR workshop only option.

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The UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) would like to provide you with an opportunity to present a poster about your research and network with our attendees at the 2019 UCLA CHIPS Workshop.  The workshop will take place on Wednesday, November 6, 2019 at UCLA. Details regarding the poster submission are below.

Research topics of interest

  • Heterogeneous integration on rigid substrates
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  • Neuromorphic circuits and systems
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  • Packaging reliability

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