We invite you to be among the first to have your article peer-reviewed and published in the new Electronics Packaging section within IEEE Access. This is an exciting opportunity for your research to benefit from the high visibility of IEEE Access. Your work will also be exposed to 5 million unique monthly users of the IEEE Xplore® Digital Library.
The Electronics Packaging Section within IEEE Access will draw on the expert technical community to continue IEEE’s commitment to publishing the most highly-cited content. Our goal is to publish quickly - the rapid peer review process has demonstrated an average submission to publication time of 5.0 weeks for the first 6 months of 2019. This journal is fully open and compliant with funder mandates, including Plan S.
The IEEE Electronics Packaging Society section in IEEE Access covers the scientific, engineering, and production aspects of materials, components, modules, hybrids and micro-electronic systems for all electronic applications, which includes technology, selection, modeling/simulation, characterization, assembly, interconnection, packaging, handling, thermal management, reliability, testing/control of the above as applied in design and manufacturing. Examples include optoelectronics and bioelectronic systems packaging, and adaptation for operation in severe/harsh environments. Emphasis is on research, analysis, development, application and manufacturing technology that advance state-of-the-art within this scope.