Join us at the Heterogeneous Integration Roadmap (HIR) Workshop hosted by the 2019 ASME InterPACK Conference
Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. With the rapid migration of logic, memory and applications to the Cloud infrastructures, Data Centers and 5G Networks, the Internet of Things (IoT) to internet of everything (IOE), Autonomous Vehicles, the proliferation of Smart Devices every where, and increasing interest in artificial intelligence (AI) & Virtual Reality (VR), the pace of innovation is increasing to meet these challenges. What are the paths forward?
There is no cost to attend the HIR workshop only. Click on the blue registration button and pick the HIR workshop only option.