71st ECTC Call for Papers

Submit an abstract for the 71st IEEE Electronic Components and Technology Conference (ECTC), to be held June 1 - June 4, 2021, at Sheraton San Diego Hotel & Marina, San Diego, CA. This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.

Deadline October 4, 2020.

Submit abstract here