Prof. CQ Cui
Chairman, Technical program
Guangdong University of Technology
The 21st International Conference on Electronics Packaging Technology (ICEPT 2020) was held at the Conference Center of Guangzhou Science City from August 12th to 15th, 2020. The conference was hosted by Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangdong University of Technology (GDUT), IEEE Electronics Packaging Society, Electronic Manufacturing and Packaging Technology Society of the Chinese Institute of Electronics, organized by School of Electromechanical Engineering, Guangdong University of Technology / State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, and co-organized by National Center for Advanced Packaging (NCAP), State Key Laboratory of Mobile Network and Mobile Multimedia Technology (ZTE), Hong Kong Applied Science and Technology Research Institute Co. Ltd., Guangdong Fozhixin Microelectronics Technology Research Co., Ltd., Guangdong XH Microelectronics Co., Ltd., Guangzhou Semiconductor Industry Association, IEEE EPS Beijing Chapter and Beijing Faith Information Consultant Ltd. More than 600 delegates from China, the United States, Sweden, Singapore, Japan, Netherlands and many other countries and regions, including experts, scholars and business representatives participated in the event.