IEEE EPS Technical Committee: High Density Substrates ＆ Boards News

Yasumitsu Orii, High Density Substrates and Boards TC Chair

The High Density Substrates ＆ Boards technical committee (TC-6) of the Electronics Packaging Society EPS is focusing on high-speed and high-density interconnect technologies, based on advanced material-, process-, structure-, and design-technologies. Application areas are ICTs, mobile electronics, automobiles/power electronics, and healthcare. High density substrates and boards are the key components placed in the center of the equipment and always need to be evolved correspondingly to the cutting edge technologies in electrical, optical, and thermal fields.