Patrick McCluskey, EPS Power & Energy Technical Committee Chair
Heterogeneous integration (HI) is not possible without a source of power for the multiple devices and components involved. While it is possible to supply this power externally to one or more devices, it is typically advantageous to integrate the conversion and distribution of this power into the HI system. This makes power delivery one of the most critical elements in an HI system. HI also provides significant advantages for power electronics as it permits wide bandgap power devices, which surpass silicon in power handling capability, efficiency, and operating temperature, to be integrated with silicon control, logic, and memory devices and with lower operating temperature passive devices. Nevertheless, HI of power electronics comes with a raft of challenges for SiP designers, as the power electronics require space, generate heat, and can cause electrical noise in the circuits.