Call for Abstracts - Symposium on Reliability for Electronics and Photonics Packaging

Date:  November 11-12, 2021 (virtual, and in-person in Silicon Valley)

Location: Silicon Valley, CA, USA

Abstract due date:  September 30th 2021.

 

Proposals for presentations as an abstract in the fields of Reliability for Electronic and Photonic Packaging are solicited under the technical areas highlighted in thislink<https://attend.ieee.org/repp/> .

 

This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.

 

COVID-19 : Due to the evolving nature of the pandemic, the symposium is being planned as a hybrid event, with both in‐person and WebEx participation .

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REPP Symposium Committee