ITHERM 2022
21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2022) 
Sponsored by IEEE EPS
Co-located with the 72nd ECTC 2022 – Joint registrations available at discounted rate
When: May 31 – June 3, 2022
Where: Sheraton Hotel & Marina San Diego, CA USA
ITherm 2022 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. In addition to paper presentations and vendor exhibits, ITherm 2022 will have keynote lectures by prominent speakers, panel discussions, invited Tech Talks, professional development courses and several student design competitions.
All papers will be peer reviewed and published in the ITherm proceedings on IEEE Xplore. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.
Our abstract submission website is now open, and we encourage your submissions through the extended deadline of September 20, 2021. Review the details in our Call for Abstracts.