NEW: Electronics Packaging Society Section within IEEE Access
We invite you to be among the first to have your article peer-reviewed and published in the new Electronics Packaging section within IEEE Access. This is an exciting opportunity for your research to benefit from the high visibility of IEEE Access. Your work will also be exposed to 5 million unique monthly users of the IEEE Xplore® Digital Library.
The Electronics Packaging Section within IEEE Access will draw on the expert technical community to continue IEEE’s commitment to publishing the most highly-cited content. The Journal peer-review process targets a publication period of 6 weeks for most acceptecd papers. This journal is fully open and compliant with funder mandates, including Plan S.
The IEEE Electronics Packaging Society section in IEEE Access covers the scientific, engineering, and production aspects of materials, components, modules, hybrids and micro-electronic systems for all electronic applications, which includes technology, selection, modeling/simulation, characterization, assembly, interconnection, packaging, handling, thermal management, reliability, testing/control of the above as applied in design and manufacturing. Examples include optoelectronics and bioelectronic systems packaging, and adaptation for operation in severe/harsh environments. Emphasis is on research, analysis, development, application and manufacturing technology that advance state-of-the-art within this scope.
Get Published in the New Electronics Packaging Society Section of IEEE Access
Select the Electronics Packaging Society (EPS) Section from the pull-down menu of “Manuscript type” in the first page of the submission process.
Author Information and Instructions
EPS is committed to supporting authors and researchers with IEEE Author Tools including the IEEE Publication Recommender, IEEE Graphics Analyzer, LaTeX Analyzer and more. Discover the tools available at the IEEE Author Center.
The EPS is regarded as a trusted and unbiased source of technical information for dialog and collaboration to advance technology within the computing community. EPS is led by researchers and technology professionals who are at the center of respected electronics packaging communities where readers and authors already come together.
The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations. Each published article is reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.
Article Processing Charge (APC): US$1,750
IEEE Members receive a 5% discount.
IEEE Society Members receive a 15% discount.
These discounts cannot be combined.
Ravi Mahajan, Intel Corporation, USA
Dale Becker, IBM Inc., USA
Muhannad Bakir, Georgia Institute of Technology, USA
Koneru Ramakrishna, Cirrus Logic, Inc., USA
Kuo-Ning Chiang, National Tsing Hua University, Taiwan