IEEE Transactions on Components, Packaging and Manufacturing Technology

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IEEE Transactions on Components, Packaging and Manufacturing Technology 

The IEEE Transactions on Components, Packaging and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems. Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal. The standard paper length is 8 pages. A mandatory Overlength Page Charge of $175 per page (beginning with page 9 and beyond) is required for papers in excess of eight printed pages.

The Transactions includes a Letters section within the publication. Papers will be a maximum of 4 pages. The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.

The technical content of all papers must be both new and significant.

Letters Manuscript Length: The standard length for an accepted manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into the IEEE Author Portal, select "Letters" as paper type.

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T-CPMT Podcasts

A Critical Review of Lithography Methodologies and Impacts of Topography

Signal and Power Integrity Analysis Breakding the Mold Beyond SPICE

 

  

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 The Transactions on Components, Packaging and Manufacturing Technology, first published in January 2011,  is a merger of three CPMT Transactions: the Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies and Transactions on Electronics Packaging Manufacturing.  Read more....

Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems.  Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal. 

Frequency

Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.

Subscription Rates (in USD)

Online          Print           
Combo
(Online/Print)
EPS Member included in membership $25 n/a
EPS Student Member included in membership $13 n/a
IEEE Member $45 $50 $60

Note:  Subcribers to the  Transactions on CPMT have online access to all EPS predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.

 

Managing Editor

Ravi Mahajan

Intel 

USA

Senior Area Editor - Advanced Packaging Technologies

Hsien-Chie Cheng
Feng Chia University 
Taiwan 

Senior Area Editor Special Topics

Koneru Ramakrishna

Private Consultant

USA

 

 

Senior Area Editor Components: Characterization and Modeling

Yogendra Joshi

Georgia Institute of Technology

USA 

Senior Area Editor - Electrical Performance of Integrated Systems

Wendem Beyene
Meta
USA

Senior Area Editor - Electronics Manufacturing

Georgia Institute of Technology
USA

Recipients of the Best IEEE T-CPMT Associate Editor Award

2023

Karlheinz Bock
Xuejun Fan
Patrick Fay

Luu Nguyen
Suresh Sitaraman

 

2022

Xiaoxiong  Gu
Yogendra K Joshi
Lavanya Aryasomayajula

2021

Wendem Beyene
Abhijit Chandra
Cemal Basaran

Xiaobing Luo
Chuan Seng Tan
Paragkumar Thadesar

 

2020

Sushil Bhavnani
Stefano Grivet-Talocia
Lih-Tyng Hwang
Chin Lee
Frank Shi
Markondeya Pulugurtha

2019

Hsien-Chie Cheng
Wen-Yan Yin
Tzong-Lin Wu
John McBride
John Shea
Bing Dang