IEEE Transactions on Components, Packaging and Manufacturing Technology

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IEEE Transactions on Components, Packaging and Manufacturing Technology 

The IEEE Transactions on Components, Packaging and Manufacturing Technology includes a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.  The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.

The technical content of papers must be both new and significant.

Manuscript Length: The standard length for an accepted manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into ScholarOne, select "Letters" as paper type.

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 The Transactions on Components, Packaging and Manufacturing Technology, first published in January 2011,  is a merger of three CPMT Transactions: the Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies and Transactions on Electronics Packaging Manufacturing.  Read more....


IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems.  Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal. 


Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.

Subscription Rates (in USD)

Online          Print           
EPS Member included in membership $25 n/a
EPS Student Member included in membership $13 n/a
IEEE Member $45 $50 $60

Note:  Subcribers to the  Transactions on CPMT have online access to all EPS predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.


Managing Editor

Ravi Mahajan



Senior Area Editor - Advanced Packaging Technologies

Hsien-Chie Cheng
Feng Chia University 

Senior Area Editor Special Topics

Koneru Ramakrishna

Private Consultant




Senior Area Editor Components: Characterization and Modeling

Yogendra Joshi

Georgia Institute of Technology


Senior Area Editor - Electrical Performance of Integrated Systems

Wendem Beyene

Senior Area Editor - Electronics Manufacturing

Georgia Institute of Technology

Recipients of the Best IEEE T-CPMT Associate Editor Award


Karlheinz Bock
Xuejun Fan
Patrick Fay

Luu Nguyen
Suresh Sitaraman



Xiaoxiong  Gu
Yogendra K Joshi
Lavanya Aryasomayajula


Wendem Beyene
Abhijit Chandra
Cemal Basaran

Xiaobing Luo
Chuan Seng Tan
Paragkumar Thadesar



Sushil Bhavnani
Stefano Grivet-Talocia
Lih-Tyng Hwang
Chin Lee
Frank Shi
Markondeya Pulugurtha


Hsien-Chie Cheng
Wen-Yan Yin
Tzong-Lin Wu
John McBride
John Shea
Bing Dang

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