IEEE Transactions on Components, Packaging and Manufacturing Technology
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IEEE Transactions on Components, Packaging and Manufacturing Technology
NEW: The IEEE Transactions on Components, Packaging and Manufacturing Technology will now include a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment. The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.
The technical content of papers must be both new and significant.
Manuscript Length: The standard length for an accepted manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available).
When submitting your Letters into ScholarOne, select "Letters" as paper type.
Submit a Paper View Current and Past Issue Table of Contents View top accessed articles
Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems. Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal.
Frequency
Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.
Subscription Rates (in USD)
| Online |
Combo
(Online/Print)
| ||
|---|---|---|---|
| EPS Member | included in membership | $25 | n/a |
| EPS Student Member | included in membership | $13 | n/a |
| IEEE Member | $45 | $50 | $60 |
| Non-Member | $1515 | $1740 | $2175 |
Note: Subcribers to the Transactions on CPMT have online access to all EPS predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.
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Managing Editor Intel USA |
Senior Area Editor - Advanced Packaging Technologies Hsien-Chie ChengFeng Chia University Taiwan |
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Senior Area Editor - Special Topics Private Consultant USA
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Senior Area Editor - Components: Characterization and Modeling Georgia Institute of Technology USA
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Senior Area Editor - Electrical Performance of Integrated Systems Wendem BeyeneMeta USA |
Senior Area Editor - Electronics Manufacturing Georgia Institute of Technology
USA
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Recipients of the Best IEEE T-CPMT Associate Editor Award
2022
Xiaoxiong Gu
Yogendra K Joshi
Lavanya Aryasomayajula
2021
Wendem Beyene
Abhijit Chandra
Cemal Basaran
Xiaobing Luo
Chuan Seng Tan
Paragkumar Thadesar
2020
Sushil Bhavnani
Stefano Grivet-Talocia
Lih-Tyng Hwang
Chin Lee
Frank Shi
Markondeya Pulugurtha
2019
Hsien-Chie Cheng
Wen-Yan Yin
Tzong-Lin Wu
John McBride
John Shea
Bing Dang