IEEE Transactions on Components, Packaging and Manufacturing Technology

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IEEE Transactions on Components, Packaging and Manufacturing Technology 

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 The Transactions on Components, Packaging and Manufacturing Technology, first published in January 2011,  is a merger of three CPMT Transactions: the Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies and Transactions on Electronics Packaging Manufacturing.  Read more....

 

Scope 

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Frequency

Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.

Subscription Rates (in USD)

Online          Print           
Combo
(Online/Print)
EPS Member included in membership $25 n/a
EPS Student Member included in membership $13 n/a
IEEE Member $45 $50 $60
Non-Member $1345 $1545 $1930

Note:  Subcribers to the  Transactions on CPMT have online access to all EPS predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.

  

 

Managing Editor

Ravi Mahajan

Intel 

Advanced Packaging  

Chandler, AZ  USA

phone: +1 480 554 371

 

Senior Area Editor - Advanced Packaging Technologies

Kuo-Ning Chiang
National Tsing Hua University 
Department of Power Mechanical Engineering 
Hsinchu,  Taiwan 
phone: 886 3 5742925

Senior Area Editor - Special Topics

Ravi Mahajan

Intel 

Advanced Packaging  

Chandler, AZ  USA

phone: +1 480 554 371

 

Senior Area Editor Components: Characterization and Modeling

Koneru Ramakrishna

Cirrus Logic, Inc.

Assembly & Packaging Engineering
Austin, TX   USA 
phone: 512-851-4484

 

Senior Area Editor - Electrical Performance of Integrated Systems

Dale Becker
IBM
Systems
Poughkeepsie, NY  USA
phone: +1 845 435-6735

Senior Area Editor - Electronics Manufacturing

School of Elec. and Comp. Eng.
Georgia Tech
Atlanta, GA USA
phone: +1 404 385 6276