Heterogeneous Integration Roadmap 2019 Edition Additional chapters will be added as they complete their peer review Interested in hearing the latest updates and news on the Heterogeneous Integration Roadmap? Please sign up IEEE Press Release on HIR Chapter 1 Overview Chapter 2 High Performance Computing Chapter 4 Medical Chapter 5 Automotive Chapter 6 Aerospace & Defense Chapter 7 Mobile Chapter 8 Single & Multi Chip Chapter 9 Photonics Chapter 11 MEMS Chapter 12 5G Chapter 13 Co Design Chapter 14 Simulation Chapter 15 Materials Chapter 16 Emerging Devices Chapter 17 Test Chapter 18 Supply Chain Chapter 19 Security Chapter 20 Thermal Chapter 21 SiP and Module Chapter 22 Interconnects Chapter 23 Wafer Level Packaging TechnologyHeterogeneous Integration Roadmap2019 EditionECTC 2019 Workshop PresentationsTechnical Committees
