IEEE Electronics Packaging Society IEEE Electronics Packaging Society

Heterogeneous Integration Roadmap 2019 Edition

Additional chapters will be added as they complete their peer review

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IEEE Press Release on HIR

overview

Chapter 1 Overview

HPC

Chapter 2 High Performance Computing

health

Chapter 4 Medical

Automotive

Chapter 5 Automotive

AD

Chapter 6 Aerospace & Defense

mobile

Chapter 7 Mobile

SMC

Chapter 8 Single & Multi Chip

phot

Chapter 9 Photonics

MEMS

Chapter 11 MEMS

5G

Chapter 12 5G 

COD

Chapter 13 Co Design

SIM

Chapter 14 Simulation

Material

Chapter 15 Materials

ERD

Chapter 16 Emerging Devices

Test

Chapter 17 Test

Test

Chapter 18 Supply Chain

Security

Chapter 19 Security

Thermal

Chapter 20 Thermal

SIP

Chapter 21 SiP and Module

2D 3D

Chapter 22 Interconnects

 

2D 3D

Chapter 23 Wafer Level Packaging