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  • 2021 Edition

Heterogeneous Integration Roadmap 2021 Edition

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Chapter 1 Overview

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Chapter 2 High Performance Computing

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Chapter 3 IoT

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Chapter 4 Medical, Health

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Chapter 5 Automotive

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Chapter 6 Aerospace & Defense

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Chapter 7 Mobile

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Chapter 8 Single Chip & Multi Chip

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Chapter 9 Photonics

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Chapter 10 Power Electronics

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Chapter 11 MEMS and Sensors

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Chapter 12 5G Communications

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Chapter 13 Co-Design

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Chapter 14 Modeling & Simulation

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Chapter 15 Emerging Materials

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Chapter 16 Emerging Devices

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Chapter 17 Test

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Chapter 18 Supply Chain

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Chapter 19 Cyber Security

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Chapter 20 Thermal

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Chapter 21 SiP and Module

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Chapter 22 Interconnects for 2D & 3D

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Chapter 23 Wafer Level Packaging

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Chapter 24 Reliability


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