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Heterogeneous Integration Roadmap
2021 Edition

Heterogeneous Integration Roadmap 2021 Edition

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Chapter 1 Overview

Chapter 2 High Performance Computing

Chapter 4 Medical, Health

Chapter 5 Automotive

Chapter 6 Aerospace & Defense

Chapter 7 Mobile

Chapter 8 Single Chip & Multi Chip

Chapter 9 Photonics

Chapter 10 Power Electronics

Chapter 11 MEMS and Sensors

Chapter 12 5G Communications

Chapter 13 Co-Design

Chapter 14 Modeling & Simulation

Chapter 15 Emerging Materials

Chapter 16 Emerging Devices

Chapter 17 Test

Chapter 18 Supply Chain

Chapter 19 Cyber Security

Chapter 20 Thermal

Chapter 21 SiP and Module

Chapter 22 Interconnects for 2D & 3D

Chapter 23 Wafer Level Packaging

Chapter 24 Reliability

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