TC - 3D/TSV
Chair: Peter Ramm, Fraunhofer, Germany
Co Chairs: Paul Franzon, North Carolina State University and Phil Garrou, Consultant
Focus: 3D electronics, Non-TSV 3D technologies, Chiplet (dielet) assembly, C2W (chip to wafer), W2W (wafer to wafer), 2.5D and alternative interposer concepts, Monolithic integration
Activities: Organizes IEEE 3DIC Conference.
Committee Meetings: At IEEE 3DIC Conference.