TC - 3D/TSV

Chair: Peter Ramm,  Fraunhofer, Germany

Co Chairs: Paul Franzon, North Carolina State University and Phil Garrou, Consultant  

 

Focus: 3D electronics, Non-TSV 3D technologies, Chiplet (dielet) assembly, C2W (chip to wafer), W2W (wafer to wafer), 2.5D and alternative interposer concepts, Monolithic integration

 

Activities: Organizes IEEE 3DIC Conference.

 

Committee Meetings:  At IEEE 3DIC Conference.