TC - 3D/TSV

Chair: Paul Franzon,  NC State University, NC, USA  (View Bio)

 

Co-Chair: Philip Garrou, Consultant, USA  (View Bio)

 

Focus: 3D electronics, including chip to chip stacking, interposers and TSVs.

 

Activities: Organizes IEEE 3DIC Conference.

 

Committee Meetings:  At IEEE 3DIC Conference.