TC - Electrical Design, Modeling & Simulation
Chair:Dale Becker, IBM, USA
Focus: All aspects of electrical design as it relates to Signal Integrity, Power Integrity, Electromagnetic Interference, electromagnetic modeling, multi-physics analysis, Design Tools, System level issues and High Frequency Measurements with emphasis on digital, RF, optoelectronics, microwave and mixed signal electronics.
Activities: Orgnaizes three major conferences every year: 1) Electrical Performance of Electronic Packaging and Systems (EPEPS); 2) Signal and Power Integrity (SPI) and 3) Electrical Design of Advanced Packaging and Systems (EDAPS) . In additon, participates in organizing the modeling sessions at ECTC.
Committee Meetings: At EPEPS.