TC - High Density Substrates & Boards

Chair: Takashi Hisada

Focus: High-speed and high-density interconnect technologies, based on advanced material-, process-, structure-, and design-technologies. Application areas are ICTs, mobile electronics, automobiles/power electronics, and healthcare.

Website:  High Density Substrates & Boards website

Activities:  Organizes CPMT Seminar at ECTC (2012 - "Coreless substrate technologies").

Committee Meetings:  At ECTC and Septmber in Tokyo.