TC - High Density Substrates & Boards

ChairYasumitsu K Orii, IBM, Japan


Focus: High-speed and high-density interconnect technologies, based on advanced material-, process-, structure-, and design-technologies. Application areas are ICTs, mobile electronics, automobiles/power electronics, and healthcare.


Website:  High Density Substrates & Boards website


Activities:  Organizes CPMT Seminar at ECTC (2012 - "Coreless substrate technologies").


Committee Meetings:  At ECTC and Septmber in Tokyo.