TC - Materials & Processes
Chair: Bing Dang, IBM Research
Co-Chair: Yi Li, Intel Corporation
Co-Chair: Yang Liu, Nokia Bell Lab
Website: Materials & Processes TC webpage
Focus: Traditional and emerging packaging materials and processes.
Goal: Build the technical community for professionals who are specialized in material & processing such as adhesive, solder, dielectrics, photolithography, wafer processing, chip bonding, 3D integration, etc.
Activities: EPS M & P Technical Committee will meet regularly to discuss plans and strategy to improve the communication and engagement within the community. Regular webinars will be hosted and and newsletters will be posted.