TC - Materials & Processes

ChairBing Dang, IBM Research

Co-Chair: Yi Li, Intel Corporation

Co-Chair: Yang Liu, Nokia Bell Lab

Website: Materials & Processes TC webpage

Focus:  Traditional and emerging packaging materials and processes.

Goal:  Build the technical community for professionals who are specialized in material & processing such as adhesive, solder, dielectrics, photolithography, wafer processing, chip bonding, 3D integration, etc.

Activities:  EPS M & P Technical Committee will meet regularly to discuss plans and strategy to improve the communication and engagement within the community. Regular webinars will be hosted and and newsletters will be posted.