Technical Committee - Materials & Processes - IEEE Electronics Packaging Society

TC - Materials & Processes


Chair
Bing Dang, IBM 

 

Co-Chair: Dongwook Kim, Qualcomm, USA

 

Website: http://www.ewh.ieee.org/soc/cpmt/tc5/

 

Focus:  Traditional and emerging packaging materials and processes.

 

Activities:  Advanced Packaging Materials Symposium (2013).

 

Committee Meetings:  At ECTC and other major international conferences.