IEEE Electronics Packaging Society IEEE Electronics Packaging Society
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Lake Buena Vista, FL USA Jul 21, 2020 - Jul 23, 2020
2020 21st International Conference on Electronic Packaging Technology (ICEPT) Guangzhou, China Aug 12, 2020 - Aug 15, 2020
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA Aug 23, 2020 - Aug 25, 2020
2020 42nd Annual EOS/ESD Symposium (EOS/ESD) Reno, NV USA Sep 13, 2020 - Sep 18, 2020
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Tønsberg, Norway Sep 15, 2020 - Sep 18, 2020
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Berlin, Germany Sep 23, 2020 - Sep 25, 2020
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA USA Oct 4, 2020 - Oct 7, 2020
2020 IEEE International Conference on Quantum Computing and Engineering (QCE) Broomfield, CO USA Oct 12, 2020 - Oct 16, 2020
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Taipei, Taiwan Oct 21, 2020 - Oct 23, 2020
2020 International EOS/ESD Symposium on Design and System (IEDS) Chengdu, SICHUAN, China Nov 11, 2020 - Nov 13, 2020
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Singapore Dec 2, 2020 - Dec 4, 2020
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Shenzhen, China Dec 14, 2020 - Dec 16, 2020
2021 IEEE International Workshop on Integrated Power Packaging (IWIPP) Aalborg East, Denmark Apr 28, 2021 - Apr 30, 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021
2021 IEEE 67th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 24, 2021 - Oct 27, 2021
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2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021 Abstract Submission Date: Oct 16, 2020
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IEEE Electronics Packaging Award

 KoyanagiRamm

Recipients of the 2020

IEEE Electronics Packaging Award

Mitsumasa Koyanagi and Peter Ramm

"For pioneering contributions leading to the commercialization of 3D wafer and die level stacking packaging"

2020 IEEE ITherm

To be Held Virtually and On Demand

July 21-23, 2020

 

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