IEEE Electronics Packaging Society IEEE Electronics Packaging Society
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Hong Kong Dec 17, 2018 - Dec 20, 2018
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Hannover, Germany Mar 24, 2019 - Mar 27, 2019
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Toulouse, France Apr 24, 2019 - Apr 26, 2019
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 6, 2019 - May 9, 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Las Vegas, NV USA May 29, 2019 - May 31, 2019
2019 IEEE 8th International Workshop on Advances in Sensors and Interfaces (IWASI) Otranto, Italy Jun 13, 2019 - Jun 14, 2019
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Chambéry, France Jun 18, 2019 - Jun 21, 2019
2019 IEEE Holm Conference on Electrical Contracts Milwaukee, WI USA Sep 14, 2019 - Sep 18, 2019
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) Pisa, Italy Sep 16, 2019 - Sep 19, 2019
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021
View More Upcoming Conferences →
2019 IEEE Holm Conference on Electrical Contracts Milwaukee, WI USA Sep 14, 2019 - Sep 18, 2019 Abstract Submission Date: Feb 8, 2019
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) Pisa, Italy Sep 16, 2019 - Sep 19, 2019 Abstract Submission Date: Jan 15, 2019
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IEEE Electronics Packaging Award

 Suhir

Recipient of 2019

IEEE Electronics Packaging Award

Ephraim Suhir

Professor, Portland State University, Portland, Oregon, USA 

“For seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems”
 
 

EPTC 2018

December 4 - 7, 2018
Singapore

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