IEEE Electronics Packaging Society IEEE Electronics Packaging Society
2019 Electrical Design of Advanced Packaging and Systems (EDAPS) KAOHSIUNG, Taiwan Dec 16, 2019 - Dec 18, 2019
2020 Pan Pacific Microelectronics Symposium (Pan Pacific) Waimea, HI USA Feb 10, 2020 - Feb 13, 2020
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Kraków, Poland Apr 26, 2020 - Apr 29, 2020
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 4, 2020 - May 7, 2020
2020 43rd International Spring Seminar on Electronics Technology (ISSE) Liptovský Mikuláš, Slovakia May 13, 2020 - May 17, 2020
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2020 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Osaka, Japan Jun 22, 2020 - Jun 24, 2020
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Tønsberg, Norway Sep 15, 2020 - Sep 18, 2020
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Berlin, Germany Sep 23, 2020 - Sep 25, 2020
2020 66th IEEE Holm Conference on Electrical Contacts and Intensive Course (HLM) San Antonio, TX USA Sep 30, 2020 - Oct 7, 2020
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA USA Oct 4, 2020 - Oct 7, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021
View More Upcoming Conferences →
2020 43rd International Spring Seminar on Electronics Technology (ISSE) Liptovský Mikuláš, Slovakia May 13, 2020 - May 17, 2020 Abstract Submission Date: Jan 20, 2020
2020 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Osaka, Japan Jun 22, 2020 - Jun 24, 2020 Abstract Submission Date: Dec 15, 2019
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Tønsberg, Norway Sep 15, 2020 - Sep 18, 2020 Abstract Submission Date: Feb 16, 2020
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Berlin, Germany Sep 23, 2020 - Sep 25, 2020 Abstract Submission Date: Apr 10, 2020
2020 66th IEEE Holm Conference on Electrical Contacts and Intensive Course (HLM) San Antonio, TX USA Sep 30, 2020 - Oct 7, 2020 Abstract Submission Date: Feb 8, 2020
View More Call for Papers →

IEEE Electronics Packaging Award

 Suhir

Recipient of 2019

IEEE Electronics Packaging Award

Ephraim Suhir

Professor, Portland State University, Portland, Oregon, USA 

“For seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems”

 Read more

 

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

Singapore

December 4- 6, 2019

 

Join IEEE EPS
people_around_globe_blue

Join your professional colleagues –become a member of EPS.

 

 

IEEE Technology Navigator