2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 4, 2020 - May 7, 2020
2020 43rd International Spring Seminar on Electronics Technology (ISSE) Liptovský Mikuláš, Slovakia May 13, 2020 - May 17, 2020
IEEE Workshop on Signal & Power Integrity (SPI) Cologne May 17, 2020 - May 20, 2020
2020 International EOS/ESD Symposium on Design and System (IEDS) Chengdu, SICHUAN, China May 19, 2020 - May 22, 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2020 30th International Conference on Electrical Contacts (ICEC) Rorschach, Switzerland Jun 15, 2020 - Jun 18, 2020
2020 14th International Congress Molded Interconnect Devices (MID) Amberg, Germany Sep 29, 2020 - Sep 30, 2020
2020 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 9, 2020 - Nov 11, 2020
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Shenzhen, China Dec 14, 2020 - Dec 16, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) Guangzhou, China Aug 12, 2020 - Aug 15, 2020 Abstract Submission Date: Mar 20, 2020
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Berlin, Germany Sep 23, 2020 - Sep 25, 2020 Abstract Submission Date: Apr 10, 2020
2020 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) Kuala Lumpur, Malaysia Sep 28, 2020 - Sep 30, 2020 Abstract Submission Date: Mar 1, 2020
2020 14th International Congress Molded Interconnect Devices (MID) Amberg, Germany Sep 29, 2020 - Sep 30, 2020 Abstract Submission Date: Mar 2, 2020
2020 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 9, 2020 - Nov 11, 2020 Abstract Submission Date: May 22, 2020
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IEEE Electronics Packaging Award

 KoyanagiRamm

Recipients of the 2020

IEEE Electronics Packaging Award

Mitsumasa Koyanagi and Peter Ramm

"For pioneering contributions leading to the commercialization of 3D wafer and die level stacking packaging"