2023 IEEE Design and Technology of Modern Electronic Systems (DTMES) Addis Ababa, Ethiopia Feb 13, 2023 - Feb 15, 2023
6th Annual HIR Symposium Santa Clara, United States Feb 22, 2023 - Feb 24, 2023
2023 International Conference on Electronics Packaging (ICEP) Kumamoto, Japan Apr 19, 2023 - Apr 22, 2023
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 1, 2023 - May 4, 2023
2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) Aveiro, Portugal May 7, 2023 - May 10, 2023
2023 46th International Spring Seminar on Electronics Technology (ISSE) Timisoara, Romania May 10, 2023 - May 14, 2023
2023 IEEE International 3D Systems Integration Conference (3DIC) Cork, Ireland May 10, 2023 - May 12, 2023
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Cambridge, United Kingdom Sep 11, 2023 - Sep 14, 2023
2023 45th Annual EOS/ESD Symposium (EOS/ESD) Riverside, CA USA Oct 1, 2023 - Oct 6, 2023
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Rose-Hill, Mauritius Dec 12, 2023 - Dec 14, 2023
2025 IEEE 70th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 15, 2025 - Oct 22, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 25, 2026 - May 30, 2026
2027 IEEE 77th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 31, 2027 - Jun 5, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC) Grapevine, TX USA May 29, 2028 - Jun 3, 2028
2031 IEEE 81st Electronic Components and Technology Conference (ECTC) Grapevine, TX USA May 22, 2031 - Jun 1, 2031
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2023 9th International Workshop on Advances in Sensors and Interfaces (IWASI) Monopoli (Bari), Italy Jun 8, 2023 - Jun 9, 2023 Abstract Submission Date: Mar 1, 2023
2023 45th Annual EOS/ESD Symposium (EOS/ESD) Riverside, CA USA Oct 1, 2023 - Oct 6, 2023 Abstract Submission Date: Feb 6, 2023
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IEEE Electronics Packaging Award

Guoqi Kouchi Zhang 

Recipient of the 2023

IEEE Rao R. Tummala Electronics Packaging Award

Guoqi (Kouchi) Zhang

"For scientific and technological leadership in "More than Moore" (MTM) packaging, co-designing, and reliability."

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