IEEE CPMT Society has changed its name to the IEEE Electronics Packaging Society. Read more.

2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA Apr 30, 2018 - May 3, 2018
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) Brest, France May 22, 2018 - May 25, 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 29, 2018 - Jun 1, 2018
2018 IEEE Electronic Design Process Symposium (EDPS) Milpitas, CA USA Sep 13, 2018 - Sep 14, 2018
2018 7th Electronic System-Integration Technology Conference (ESTC) Dresden, Germany Sep 18, 2018 - Sep 21, 2018
2018 13th International Congress Molded Interconnect Devices (MID) Würzburg, Germany Sep 25, 2018 - Sep 26, 2018
2018 IEEE Holm Conference on Electrical Contacts Albuquerque, NM USA Oct 14, 2018 - Oct 18, 2018
2018 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 19, 2018 - Nov 21, 2018
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Toulouse, France Apr 24, 2019 - Apr 26, 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021
View More Upcoming Conferences →
2018 IEEE Electronic Design Process Symposium (EDPS) Milpitas, CA USA Sep 13, 2018 - Sep 14, 2018 Abstract Submission Date: Jun 15, 2018
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Taipei, Taiwan Oct 24, 2018 - Oct 26, 2018 Abstract Submission Date: Jun 15, 2018
2018 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 19, 2018 - Nov 21, 2018 Abstract Submission Date: May 25, 2018
2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Chandigarh, India Dec 16, 2018 - Dec 18, 2018 Abstract Submission Date: Jul 22, 2018
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Hong Kong Dec 17, 2018 - Dec 20, 2018 Abstract Submission Date: Jul 31, 2018
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Toulouse, France Apr 24, 2019 - Apr 26, 2019 Abstract Submission Date: Nov 17, 2018
View More Call for Papers →

IEEE Electronics Packaging Award

 Bill Screen Shot Image 2

Recipient of 2018

IEEE Electronics Packaging Award

William Chen

         Fellow of ASE Group, Sunnyvale, California, USA 

“For contributions to electronic packaging from research and development through industrialization, and for his leadership in strategic roadmapping efforts.”
 
 

EuroSimE 2018

April 16 - 18, 2018
Toulouse, France

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