2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Shenzhen, China Dec 14, 2020 - Dec 16, 2020
2021 IEEE International Workshop on Integrated Power Packaging (IWIPP) Aalborg East, Denmark Apr 28, 2021 - Apr 30, 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021
2020 International EOS/ESD Symposium on Design and System (IEDS) Chengdu, SICHUAN, China Jun 23, 2021 - Jun 25, 2021
2021 IEEE 67th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 24, 2021 - Oct 27, 2021
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 30, 2022 - Jun 4, 2022
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 27, 2024 - Jun 1, 2024
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) Orlando, FL USA May 26, 2025 - May 31, 2025
2025 IEEE 69th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 15, 2025 - Oct 22, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 25, 2026 - May 30, 2026
2027 IEEE 77th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 31, 2027 - Jun 5, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC) Grapevine, TX USA May 29, 2028 - Jun 3, 2028
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2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) DC, WA USA May 3, 2021 - May 6, 2021 Abstract Submission Date: Oct 30, 2020
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IEEE Electronics Packaging Award

 KoyanagiRamm

Recipients of the 2020

IEEE Electronics Packaging Award

Mitsumasa Koyanagi and Peter Ramm

"For pioneering contributions leading to the commercialization of 3D wafer and die level stacking packaging"

IMPACT 2020

Hybrid Event October 21 - 23, 2020 


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