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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Catania, Italy
Apr 7, 2024 - Apr 10, 2024
Abstract Submission Date: Oct 30, 2023
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2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Tampere, Finland
Jun 11, 2024 - Jun 13, 2024
Abstract Submission Date: Jan 31, 2024
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IEEE Electronics Packaging Award
Recipient of the 2024
IEEE Rao R. Tummala Electronics Packaging Award
Madhavan Swaminathan
“For contributions to semiconductor packaging and system integration technologies that improvethe performance, efficiency, and capabilities of electronic systems.”
Budapest, Hungary
Sep 27, 2023 - Sep 29, 2023
24th Annual EOS/ESD Symposium (EOS/ESD)
24th Annual EOS/ESD Symposium (EOS/ESD)
Riverside, CA USA
Oct 1 - Oct 6, 2023

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