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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Oct 26, 2023 - Oct 28, 2023
Abstract Submission Date: Jun 22, 2023
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2023 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)
Milpitas, CA USA
Nov 17, 2023 - Nov 18, 2023
Abstract Submission Date: Aug 16, 2023
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2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
San Jose, CA USA
Mar 26, 2024 - Mar 30, 2024
Abstract Submission Date: Sep 16, 2023
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2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, CO USA
May 29, 2024 - Jun 1, 2024
Abstract Submission Date: Sep 5, 2023
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IEEE Electronics Packaging Award
Recipient of the 2023
IEEE Rao R. Tummala Electronics Packaging Award
Guoqi (Kouchi) Zhang
"For scientific and technological leadership in "More than Moore" (MTM) packaging, co-designing, and reliability."
Monopoli (Bari), Italy
Jun 8, 2023 - Jun 9, 2023
Oslo, Norway
Jun 12, 2023 - Jun 14, 2023
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