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2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
China
Aug 11, 2021 - Aug 14, 2021
Abstract Submission Date: Mar 30, 2021
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2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)
Tel Aviv, Israel
Nov 1, 2021 - Nov 3, 2021
Abstract Submission Date: May 3, 2021
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2021 10th IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Nov 10, 2021 - Nov 12, 2021
Abstract Submission Date: May 28, 2021
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IEEE Electronics Packaging Award
Recipient of the 2021
IEEE Electronics Packaging Award
Chin C. Lee
"For contributions to new silver alloys, new bonding methods, flip-chip interconnect, and education for electronics packaging"
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2021 EuroSimE
Virtual Event April 19 - 21, 2021
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