2021 43rd Annual EOS/ESD Symposium (EOS/ESD) Tucson, AZ USA Sep 25, 2021 - Sep 30, 2021
2021 IEEE 67th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 23, 2021 - Oct 26, 2021
2021 10th IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 9, 2021 - Nov 11, 2021
2022 IEEE Design and Technology of Modern Electronic Systems (DTMES) Addis Ababa, Ethiopia Feb 7, 2022 - Feb 9, 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 29, 2022 - Jun 3, 2022
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) Aalborg East, Denmark Aug 23, 2022 - Aug 25, 2022
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 26, 2024 - May 31, 2024
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) Orlando, FL USA May 25, 2025 - May 30, 2025
2025 IEEE 69th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 14, 2025 - Oct 21, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 24, 2026 - May 29, 2026
2027 IEEE 77th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 30, 2027 - Jun 4, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC) Grapevine, TX USA May 28, 2028 - Jun 2, 2028
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2021 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP) Milpitas, CA USA Nov 10, 2021 - Nov 11, 2021 Abstract Submission Date: Aug 19, 2021
2022 IEEE Design and Technology of Modern Electronic Systems (DTMES) Addis Ababa, Ethiopia Feb 7, 2022 - Feb 9, 2022 Abstract Submission Date: Oct 7, 2021
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 29, 2022 - Jun 3, 2022 Abstract Submission Date: Oct 9, 2021
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) San Diego, CA USA May 30, 2022 - Jun 2, 2022 Abstract Submission Date: Sep 5, 2021
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IEEE Electronics Packaging Award

 2021 eps lee

Recipient of the 2021

IEEE Electronics Packaging Award

Chin C. Lee

"For contributions to new silver alloys, new bonding methods, flip-chip interconnect, and education for electronics packaging"

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2021 22nd International Conference on Electronic Packaging Technology

August 10~13, 2021

Xiamen, China


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