2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) Grenoble, France Aug 24, 2022 - Aug 26, 2022
2022 44th Annual EOS/ESD Symposium (EOS/ESD) Reno, NV USA Sep 18, 2022 - Sep 23, 2022
2022 IEEE 67th Holm Conference on Electrical Contacts (HLM) Tampa, FL USA Oct 23, 2022 - Oct 26, 2022
2022 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 9, 2022 - Nov 11, 2022
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Cambridge, United Kingdom Sep 11, 2023 - Sep 14, 2023
2025 IEEE 70th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 15, 2025 - Oct 22, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 25, 2026 - May 30, 2026
2027 IEEE 77th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 31, 2027 - Jun 5, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC) Grapevine, TX USA May 29, 2028 - Jun 3, 2028
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2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Miami, FL USA Feb 1, 2023 - Feb 3, 2023 Abstract Submission Date: Jul 11, 2022
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) Orlando, FL USA May 29, 2023 - Jun 3, 2023 Abstract Submission Date: Oct 10, 2022
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Orlando, FL USA May 30, 2023 - Jun 2, 2023 Abstract Submission Date: Sep 5, 2022
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IEEE Electronics Packaging Award

Douglas C.H. Yu 

Recipient of the 2022

IEEE Rao R. Tummala Electronics Packaging Award

Douglas C. H. Yu

"“For contributions to the development of advanced packaging technologies and their implementation in high-volume manufacturing.”

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August 10-13, 2022
Dalian, China

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