Bio Hiroshi Nishikawa

Hiroshi Nishikawa has received his MS degree in 1999 and Dr. of Engineering in 2002 from Osaka University, Japan. He joined at Collaborative Research Center for Advanced Science and Technology of Osaka University in 2002 as Assistant Professor. From 2005 he has been working at Joining and Welding Research Institute of Osaka University and now is Associate Professor.

He focuses his study on interconnection and micro-joining process for electronics packaging, especially by using lead-free solders, electrically conductive adhesives and nanomaterials such as nanoparticles and nanoporous metals. He is included in developing new materials and bonding processes, and characterizing them for electronics packaging. His study also involves in evaluating and improving long-term-reliability of the joints.