EPS President: Chris Bailey
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.
The EPS promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations.
It is one of 38 technical Societies within the IEEE.
Field of Interest
The EPS field of Interest includes all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components; addressing signal and power delivery, material aspects, thermal and structural design and reliability. The Society drives science, technology, engineering, test, modeling, simulation, design, manufacturing, interconnection and performance of integrated components. It sponsors and provides electronics packaging education and reports on electronics packagingresearch worldwide.
Through its sponsored and cosponsored conferences and workshops held throughout the world, as well as its peer-reviewed Transactions containing articles from authors worldwide, the EPS provides the best available technical information.
Chapters throughout the US, Europe and Asia/Pacific provide opportunities for groups of local members to meet and participate in activities on a more frequent basis, often focusing on the particular profile of the locale.
The Society is managed by a Board of Governors composed of elected and appointed volunteer members. A set of operational committees oversee key activities and functions of the Society.
The Society collaborates and cooperates with other IEEE Societies as well as with other professional associations through initiatives, publications, conferences and councils. Following are some of the areas and activities that EPS jointly sponsors or supports:
Heterogeneous Integration Road Map
Women in Engineering
PublicationsIEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Nanotechnology
IEEE Internet of Things Journal
IEEE Sensors Journal
IEEE RFID Virtual Journal
IEEE Transactions on Applied Superconductivity
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
IEEE Journal on Photovoltaics
IEEE Transactions on NanoBioscience
IEEE Transactions on Big Data
IEEE Transactions on Multi-Scale Computing Systems
IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology
ASMC, DTIP, EOS/ESD, EMPC, EuroSIME, ICEPT, ISSE, THERMINIC, EDAPS, EPEP, EPTC, ESTC, IEMT-EMAP, IWASI, IWIPP, SPI
*** EPS is exploring creating a Quantum Packaging Working Group to support IEEE’s Quantum Initiative by addressing packaging, interconnects, and deep cryogenic thermal management of quantum devices. IEEE is planning a week-long Quantum Engineering Conference in October, 2020 in Colorado. EPS has been invited to co-sponsor the Conference and contribute to Keynotes, technical sessions, panels, PDC’s, and tutorials. Please contact Avi Bar-Cohen (firstname.lastname@example.org