EPS Program Director, Award Programs: Eric Perfecto    

Nomination Period Is Now Open


Nomination Form

The EPS Awards Program recognizes contributions to the profession, industry and the Society through a comprehensive set of awards and recognitions.


The highest award honoring technical achievement in EPS fields of interest  is the IEEE Electronics Packaging Award  -- an IEEE Technical Field Award, sponsored by the EPS and administered by the IEEE Awards Board.


EPS Major Awards

A series of EPS Major Awards, recognizing  technical contributions and service, is administered by the EPS Awards Committee:

Guidelines for Nominators:

·        An individual may submit only one nomination per award but may submit nominations for more than one award.

·        An individual may submit only one endorsement per award but may submit endorsement for more than one award.

·        It is the responsibility of the nominator to ensure quality documentation to assist the Awards Committee in evaluating the candidate.

·        Outstanding Sustained Technical Contribution Award is designed for the “practitioner”, while the Electronics Manufacturing Technology Award intended for “Corporate Leadership”.

·        Complimentary material, such as CV, list of publications and/or patents can be submitted with the nomination.

·        Self-nominations will not be considered.  

Additional Awards

Additional Society Awards recognize excellence in publications, Chapters and educational activities:

     EPS PhD Fellowship Award

EPS Packaging Vision Competition (Submission Period Closed)

Description: This award recognizes the best "Vision of the Future of Electronics Packaging" abstract, to be presented at the IEEE Electronic Components and Technology Conference (ECTC) during the Tuesday evening panel session. The competition welcomes submissions from students attending ECTC 2020.

Presented to: An individual or a team of no more than three.


1st Place: $1,000

2nd Place: $ 600

3rd Place:  $ 300

Eligibility: All ECTC student papers that are accepted. Winners are required to present their packaging visions at the ECTC Tuesday evening Panel Session.

Congratulations to the 2020 EPS Packaging Vision Competition Winners:

First Place: “FlexTrateTM: The Future of Flexible Packaging”: Arsalan Alam, Goutham Ezhilarasu, Randall Irwin


Second Place: “Packaging for Ultra-Large Scale Cognitive Systems”:  SivaChandra Jangam, Zhe Wan

Niloofar Sharookzadeh


Third Place: “An Additive Production approach for Microvias and Multilayered polymer substrate patterning of 2.5μm feature sizes”:  Sarthak Acharya


2019 Winners

"Brain-on-a-Package": Shreya Dwarakanath, Chandrasekharan Nair, Siddharth Ravichandran - Georgia Institute of Technology, USA

"Will Biocompatible Packaging be the First Step to Become a Cyborg": Martin Schubert - Technical University of Dresden, Germany


Other Professional Recognitions

Recognition of achievement is also found in IEEE Membership Grade.   Advancing your member grade can bring added peer recognition to your accomplishments.