Best Paper Awards
The Electronic Packaging Society recognizes the best papers published in its Transactions each year. Selection of best papers is made by the Editors-in-Chief and Associate Editors.
Prize: $1,000 (prorated if for multiple authors) and Certificate
Eligibility: Authors of papers published in the IEEE Transactions on Components and Packaging Technologies during the previous calendar year. One paper in each technical category is selected.
Basis for Judging: Originality of concept, skill in analysis, importance and timeliness of the subject, organization and lucidity of presentation.
Transactions on Components, Packaging and Manufacturing Technology Best Paper Award Recipients
Advanced Packaging Technologies Category:
2022 No Award
Components: Characterization and Modeling Category:
2022 "A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages" Chun-Pei Chen, Yaxiong Chen, Ganesh Subbarayan, Hung-Yun Lin, Siva Gurrum; Volume 12, Issue 3, March 2022
Electrical Performance of Integrated Systems Category:
2022 "Fast and Stable Circuit Simulation via Interpolation- Supported Numerical Inversion of the Laplace Transform" Emad Gad, Ye Tao, Michel Nakhla; Volume 12, Issue 1, January 2022
Electronics Manufacturing Category:
2022 No award