Upcoming Conferences

EPS Vice President, Conferences: Sam Karikalan

Important EPS Message on COVID-19 and Upcoming Conferences

Dear Members and Patrons of the IEEE Electronics Packaging Society,

With the health and safety of our members and participants being our first priority, please know that our thoughts are with those affected by the COVID-19 outbreak.

We are closely monitoring the developments related to this pandemic and working diligently with the IEEE and our conference organizing committees worldwide, on our preparedness. Some of the conferences sponsored by our society that are scheduled to be held during these challenging few months have been already rescheduled or canceled. Others are coming up in the later part of this year, and we are carefully watching the developments and ready to make swift decisions, as needed. 

The following is the current status of the EPS sponsored conferences in the remainder of 2020. This page will be updated on a weekly basis, as the situation keeps changing dynamically.

Status as of July 7, 2020

 

Conferences financially sponsored/co-sponsored by the EPS:

SPI

May 17-20, 2020

Cologne, Germany

Canceled; to be held at the same venue next year

ECTC

May 26-29, 2020

Orlando, FL, USA

In person event canceled  – 100% on demand virtual event scheduled for June 3 - 30, 2020

ITHERM

May 26-29, 2020

Orlando, FL, USA

In person event canceled – virtual event July 21-23, 2020. Live and on demand content. 

ESTC

Sep 15-18, 2020

Vestfold, Norway

Virtual Event  September 15-18, 2020

IEMT

Sep 28-30, 2020

Putrajaya, Malaysia

Postponed to September 2021

EPEPS

Oct 4-7, 2020

San Jose, CA, USA

Tentative: Oct 4-7 Live event; on demand access for remainder of month

HOLM

Oct 4-7, 2020

San Antonio, TX, USA

Postponed to Oct 24-27, 2021 

ICSJ

Nov 9-7, 2020

Kyoto, Japan

No change

EPTC

Dec 2-4, 2020

Singapore

No change - looking into possible hybrid options

EDAPS

Dec 14-16, 2020

Shenzhen, China

No change

Conferences technically sponsored/co-sponsored by the EPS:

SEMI-THERM Mar 16-20, 2020 San Jose, CA Canceled

EuroSimE

Apr 26-29, 2020

Cracow, Poland

Going virtual with live sessions on July 6-7, 2020 and on-demand content from July 6-27, 2020

ASMC

May 4-7, 2020

Saratoga Springs, NY, USA

Postponed to August 23-25, 2020

ISSE

May 13-17, 2020

Demanovska Valley, Slovakia

Virtual Conference May 14-15, 2020

IEDS

May 19-22, 2020

Chengdu, China

Postponed to Nov 11-13, 2020

ICEC

Jun 15-18, 2020

Rorschach, Switzerland

Cancelled. To be held June 7-10, 2021

DTIP Virtual Event June 15-26, 2020

3D-PEIM

Jun 22-24, 2020

Osaka U, Japan

Biennial - Postponed to Jun 21-23, 2021

ICEPT

Aug 12-15, 2020

Guangzhou, China

No Change 

EOS/ESD Symposium

Sep 13-18, 2020

Reno, NV, USA

No change

THERMINIC

Sep 23-25, 2020

Berlin, Germany

No Change

MID

Sep 29-30, 2020

Amberg, Germany

Posponed to February 9-10, 2021

QCE Oct 12-15, 2020 Denver, CO, USA No Change

IMPACT

Oct 21-23, 2020

Taipei, Taiwan

No change

 

Before traveling to any EPS sponsored conference, we recommend that you stay informed of any information your local health agencies and those at the conference location may make available and take reasonable precautions to protect yourself.

Other Resources:

World Health Organization - Coronavirus disease (COVID-19) advice for the public

Message from IEEE on Coronavirus (COVID-19) 

Resources for Conference Organizers

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

NEW:  To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award.  

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Lake Buena Vista, FL USA
Jul 21, 2020 - Jul 23, 2020
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Guangzhou, China
Aug 12, 2020 - Aug 15, 2020
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA
Aug 23, 2020 - Aug 25, 2020
2020 42nd Annual EOS/ESD Symposium (EOS/ESD)
Reno, NV USA
Sep 13, 2020 - Sep 18, 2020
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
Tønsberg, Norway
Sep 15, 2020 - Sep 18, 2020
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Berlin, Germany
Sep 23, 2020 - Sep 25, 2020
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
San Jose, CA USA
Oct 4, 2020 - Oct 7, 2020
2020 IEEE International Conference on Quantum Computing and Engineering (QCE)
Broomfield, CO USA
Oct 12, 2020 - Oct 16, 2020
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Oct 21, 2020 - Oct 23, 2020
2020 International EOS/ESD Symposium on Design and System (IEDS)
Chengdu, SICHUAN, China
Nov 11, 2020 - Nov 13, 2020
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
Singapore
Dec 2, 2020 - Dec 4, 2020
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Shenzhen, China
Dec 14, 2020 - Dec 16, 2020
2021 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Aalborg East, Denmark
Apr 28, 2021 - Apr 30, 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 16, 2020
Jun 1, 2021 - Jun 4, 2021
2021 IEEE 67th Holm Conference on Electrical Contacts (HLM)
San Antonio, TX USA
Oct 24, 2021 - Oct 27, 2021