Upcoming Conferences

EPS Vice President, Conferences: Sam Karikalan

Important EPS Message on COVID-19 and Upcoming Conferences

Dear Members and Patrons of the IEEE Electronics Packaging Society,

With the health and safety of our members and participants being our first priority, please know that our thoughts are with those affected by the COVID-19 outbreak.

We are closely monitoring the developments related to this pandemic and working diligently with the IEEE and our conference organizing committees worldwide, on our preparedness. Some of the conferences sponsored by our society that are scheduled to be held during these challenging few months have been already rescheduled or canceled. Others are coming up in the later part of this year, and we are carefully watching the developments and ready to make swift decisions, as needed. 

The following is the current status of the EPS sponsored conferences in the remainder of 2020. This page will be updated on a weekly basis, as the situation keeps changing dynamically.

Status as of April 2, 2020

Before traveling to any EPS sponsored conference, we recommend that you stay informed of any information your local health agencies and those at the conference location may make available and take reasonable precautions to protect yourself.

Other Resources:

World Health Organization - Coronavirus disease (COVID-19) advice for the public

Message from IEEE on Coronavirus (COVID-19) 

Resources for Conference Organizers

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

NEW:  To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award. 

FOR A LIMITED TIME:

The following best/outstanding papers from ECTC 2019 will be available on Xplore as Open Access until June 1, 2020.

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

Low Temperature and Pressureless Microfluidic Electroless Bonding Process for Vertical Interconnection

A MEMS Microphone in a FOWLP

An Assessment of Electromigration in 2.5D Packaging