Upcoming Conferences

EP Vice President, Conferences:  Beth Keser 

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Toulouse, France
Apr 24, 2019 - Apr 26, 2019
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA
May 6, 2019 - May 9, 2019
2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
Paris, France
May 12, 2019 - May 15, 2019
2019 42nd International Spring Seminar on Electronics Technology (ISSE)
Wrocław, Poland
May 15, 2019 - May 19, 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA
May 25, 2019 - Jun 2, 2019
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Las Vegas, NV USA
May 29, 2019 - May 31, 2019
NordPac 2019
Copenhagen, Denmark
Jun 11, 2019 - Jun 13, 2019
2019 IEEE 8th International Workshop on Advances in Sensors and Interfaces (IWASI)
Otranto, Italy
Jun 13, 2019 - Jun 14, 2019
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI)
Chambéry, France
Jun 18, 2019 - Jun 21, 2019
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Hong Kong, China
Abstract Submission Date: Apr 15, 2019
Aug 11, 2019 - Aug 15, 2019
2019 IEEE Holm Conference on Electrical Contacts
Milwaukee, WI USA
Sep 14, 2019 - Sep 18, 2019
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Pisa, Italy
Sep 16, 2019 - Sep 19, 2019
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Lecco, Italy
Abstract Submission Date: Apr 2, 2019
Sep 25, 2019 - Sep 27, 2019
2019 IEEE Electronic Design Process Symposium (EDPS)
Milpitas, CA USA
Abstract Submission Date: Apr 30, 2019
Sep 26, 2019 - Sep 27, 2019
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Abstract Submission Date: Jun 30, 2019
Oct 23, 2019 - Oct 25, 2019
2019 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Abstract Submission Date: May 24, 2019
Nov 18, 2019 - Nov 20, 2019
2019 Electrical Design of Advanced Packaging and Systems (EDAPS)
KAOHSIUNG, Taiwan
Dec 16, 2019 - Dec 18, 2019
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Lake Buena Vista, FL USA
Abstract Submission Date: Jul 1, 2019
May 26, 2020 - May 29, 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Lake Buena Vista, FL USA
Abstract Submission Date: Oct 18, 2019
May 26, 2020 - May 29, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 16, 2020
Jun 1, 2021 - Jun 4, 2021