Upcoming Conferences
EPS Vice President, Conferences: Sam Karikalan
Important EPS Message on COVID-19 and Upcoming Conferences
Dear Members and Patrons of the IEEE Electronics Packaging Society,
As always the health and safety of our members and participants is our first priority. Please know that our thoughts are with those affected by the COVID-19 outbreak.
We will continue to closely monitor the developments related to this pandemic and work diligently with the IEEE and our conference organizing committees worldwide on our preparedness. Please reference the IEEE MCE Health and Safety page for the latest information.
Before traveling to any EPS sponsored conference, we recommend that you stay informed of any information your local health agencies and those at the conference location may make available and take reasonable precautions to protect yourself.
Other Resources:
World Health Organization - Coronavirus disease (COVID-19) advice for the public
Resources for Conference Organizers
In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest.
All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues. Many produce publications that are available through IEEE Xplore.
NEW: To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference. One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award.
c2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Oslo, Norway Jun 12, 2023 - Jun 14, 2023 |
c2023 15th International Congress Mechatronic Integration Discourse (MID)2023 15th International Congress Mechatronic Integration Discourse (MID) Amberg, Germany Jun 21, 2023 - Jun 22, 2023 |
c2023 14th International Conference on Computing Communication and Networking Technologies (ICCCNT)2023 14th International Conference on Computing Communication and Networking Technologies (ICCCNT) New Delhi, India Jul 6, 2023 - Jul 8, 2023 |
c2023 24th International Conference on Electronic Packaging Technology (ICEPT)2023 24th International Conference on Electronic Packaging Technology (ICEPT) Shihezi City, China Aug 8, 2023 - Aug 11, 2023 |
c2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Cambridge, United Kingdom Sep 11, 2023 - Sep 14, 2023 |
c2023 IEEE International Conference on Quantum Computing and Engineering (QCE)2023 IEEE International Conference on Quantum Computing and Engineering (QCE) Bellevue, WA USA Sep 17, 2023 - Sep 22, 2023 |
c2023 45th Annual EOS/ESD Symposium (EOS/ESD)2023 45th Annual EOS/ESD Symposium (EOS/ESD) Riverside, CA USA Oct 1, 2023 - Oct 6, 2023 |
c2023 IEEE 68th Holm Conference on Electrical Contacts (HOLM)2023 IEEE 68th Holm Conference on Electrical Contacts (HOLM) Seattle, WA USA Oct 4, 2023 - Oct 11, 2023 |
c2023 IEEE 32nd Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS)2023 IEEE 32nd Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS) Milpitas, CA USA Oct 15, 2023 - Oct 18, 2023 |
c2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Taipei, Taiwan Abstract Submission Date: Jun 21, 2023 Oct 25, 2023 - Oct 27, 2023 |
c2023 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS)2023 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS) Tel Aviv, Israel Nov 6, 2023 - Nov 8, 2023 |
c2023 IEEE CPMT Symposium Japan (ICSJ)2023 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 15, 2023 - Nov 17, 2023 |
c2023 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)2023 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP) Milpitas, CA USA Abstract Submission Date: Aug 15, 2023 Nov 16, 2023 - Nov 17, 2023 |
cSymposium on Reliability for Electronics and Photonics PackagingSymposium on Reliability for Electronics and Photonics Packaging Milpitas, CA Nov 16, 2023 - Nov 17, 2023 |
c2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Singapore Dec 5, 2023 - Dec 8, 2023 |
c2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Rose-Hill, Mauritius Dec 12, 2023 - Dec 14, 2023 |
c2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) San Jose, CA USA Abstract Submission Date: Sep 15, 2023 Mar 25, 2024 - Mar 29, 2024 |
c2024 IEEE 74th Electronic Components and Technology Conference (ECTC)2024 IEEE 74th Electronic Components and Technology Conference (ECTC) Denver, CO USA May 27, 2024 - Jun 1, 2024 |
c2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Aurora, CO USA Abstract Submission Date: Sep 4, 2023 May 28, 2024 - May 31, 2024 |
c2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) Germany Sep 11, 2024 - Sep 13, 2024 |
c2024 IEEE 69th Holm Conference on Electrical Contacts (HOLM)2024 IEEE 69th Holm Conference on Electrical Contacts (HOLM) MD, USA Oct 6, 2024 - Oct 10, 2024 |
c2025 IEEE 75th Electronic Components and Technology Conference (ECTC)2025 IEEE 75th Electronic Components and Technology Conference (ECTC) Dallas, TX USA Abstract Submission Date: Oct 8, 2024 May 26, 2025 - May 31, 2025 |
c2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Grapevine, TX USA Abstract Submission Date: Sep 2, 2024 May 27, 2025 - May 30, 2025 |
c2025 IEEE 70th Holm Conference on Electrical Contacts (HLM)2025 IEEE 70th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 15, 2025 - Oct 22, 2025 |
c2026 IEEE 76th Electronic Components and Technology Conference (ECTC)2026 IEEE 76th Electronic Components and Technology Conference (ECTC) San Diego, CA USA Abstract Submission Date: Oct 8, 2025 May 25, 2026 - May 30, 2026 |
c2026 25th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)2026 25th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Orlando, FL USA Abstract Submission Date: Sep 8, 2025 May 26, 2026 - May 29, 2026 |
c2027 26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)2027 26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Aurora, CO USA Abstract Submission Date: Sep 7, 2026 May 25, 2027 - May 28, 2027 |
c2027 IEEE 77th Electronic Components and Technology Conference (ECTC)2027 IEEE 77th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA Abstract Submission Date: Oct 8, 2026 May 31, 2027 - Jun 5, 2027 |
c2028 IEEE 78th Electronic Components and Technology Conference (ECTC)2028 IEEE 78th Electronic Components and Technology Conference (ECTC) Grapevine, TX USA Abstract Submission Date: Oct 10, 2027 May 29, 2028 - Jun 3, 2028 |
c2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Grapevine, TX USA Abstract Submission Date: Sep 6, 2027 May 30, 2028 - Jun 2, 2028 |
c2029 IEEE 79th Electronic Components and Technology Conference (ECTC)2029 IEEE 79th Electronic Components and Technology Conference (ECTC) Orlando, FL USA Abstract Submission Date: Sep 10, 2028 May 28, 2029 - Jun 2, 2029 |
c2029 28th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)2029 28th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Orlando, FL USA Abstract Submission Date: Sep 4, 2028 May 29, 2029 - Jun 1, 2029 |
c2030 IEEE 80th Electronic Components and Technology Conference (ECTC)2030 IEEE 80th Electronic Components and Technology Conference (ECTC) Aurora, CO USA Abstract Submission Date: Oct 8, 2029 May 26, 2030 - Jun 1, 2030 |
c2030 29th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)2030 29th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Aurora, CO USA Abstract Submission Date: Sep 3, 2029 May 28, 2030 - May 31, 2030 |
c2031 IEEE 81st Electronic Components and Technology Conference (ECTC)2031 IEEE 81st Electronic Components and Technology Conference (ECTC) Grapevine, TX USA Abstract Submission Date: Oct 11, 2030 May 22, 2031 - Jun 1, 2031 |
c2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Grapevine, TX USA Abstract Submission Date: Sep 2, 2030 May 27, 2031 - May 30, 2031 |