Upcoming Conferences

EPS Vice President, Conferences: Sam Karikalan

Important EPS Message on COVID-19 and Upcoming Conferences

Dear Members and Patrons of the IEEE Electronics Packaging Society,

With the health and safety of our members and participants being our first priority, please know that our thoughts are with those affected by the COVID-19 outbreak.

We are closely monitoring the developments related to this pandemic and working diligently with the IEEE and our conference organizing committees worldwide, on our preparedness. Some of the conferences sponsored by our society that are scheduled to be held during these challenging few months have been already rescheduled or canceled. Others are coming up in the later part of this year, and we are carefully watching the developments and ready to make swift decisions, as needed. 

The following is the current status of the EPS sponsored conferences in the remainder of 2020. This page will be updated on a weekly basis, as the situation keeps changing dynamically.

Status as of September 21, 2020

Conferences financially sponsored/co-sponsored by the EPS: 2020 2021
IWIPP Aalborg, Denmark Biennial   April 28-30, 2021
SPI May 17-20, 2020 Cologne, Germany Canceled; to be held at the same venue next year
ECTC May 26-29, 2020 Orlando, FL, USA In person event canceled  – 100% on demand virtual event held June 3 - July 7, 2020 In Person Event June 1-4, 2021 San Diego, CA
ITHERM May 26-29, 2020 Orlando, FL, USA In person event canceled – Virtual event to be held July 21-23, 2020 with some live sessions. On demand content to be avaiable until Aug 19, 2020 In Person Event June 1-4, 2021 San Diego, CA
ESTC Sep 15-18, 2020 Vestfold, Norway Virtual Event  September 15-18, 2020 with live sessions. not held in 2021
IEMT Sep 28-30, 2020 Putrajaya, Malaysia Postponed  September 2021
EPEPS Oct 4-7, 2020 San Jose, CA, USA Virtual Event
HOLM Oct 4-7, 2020 San Antonio, TX, USA Postponed to Oct 24-27, 2021  October 24-27, 2021 San Antonio TX
ICSJ Nov 9-7, 2020 Kyoto, Japan Canceled November 2021
EPTC Dec 2-4, 2020 Singapore No change 
EDAPS Dec 14-16, 2020 Shenzhen, China Virtual Event
Conferences technically sponsored/co-sponsored by the EPS: 2020 2021
SEMI-THERM Mar 16-20, 2020 San Jose, CA Canceled
EuroSimE Apr 26-29, 2020 Cracow, Poland Virtual event with live sessions on July 6-7, 2020 and on-demand content from July 6-27, 2020
ASMC May 4-7, 2020 Saratoga Springs, NY, USA Virtual Event to be held Aug 24-26, 2020 
ISSE May 13-17, 2020 Demanovska Valley, Slovakia Virtual Conference May 14-15, 2020
IEDS May 19-22, 2020 Chengdu, China Canceled June 23-25, 2021
ICEC Jun 15-18, 2020 Rorschach, Switzerland Canceled June 7-10, 2021
DTIP Virtual Event June 15-26, 2020
3D-PEIM Jun 22-24, 2020 Osaka U, Japan Biennial - Postponed to Jun 21-23, 2021 June 21-23, 2021
ICEPT Aug 12-15, 2020 Guangzhou, China No Change
EOS/ESD Symposium Sep 13-18, 2020 Reno, NV, USA Hybrid - presentations delivered in person, by livestream and on-demand recording.
THERMINIC Sep 23-25, 2020 Berlin, Germany One day virtual live event Sept 24, 2020. Pre-recording presentations available Sept 14 - Oct 9, 2020
MID Sep 29-30, 2020 Amberg, Germany Posponed to February 9-10, 2021 February 9-10, 2021
QCE Oct 12-15, 2020 Denver, CO, USA Virtual Event Oct 12-16, 2020
IMPACT Oct 21-23, 2020 Taipei, Taiwan In person with virtual options for remote attendees

 

 Before traveling to any EPS sponsored conference, we recommend that you stay informed of any information your local health agencies and those at the conference location may make available and take reasonable precautions to protect yourself.


Other Resources:

World Health Organization - Coronavirus disease (COVID-19) advice for the public

Message from IEEE on Coronavirus (COVID-19) 

Resources for Conference Organizers

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

NEW:  To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award.  

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
San Jose, CA USA
Oct 4, 2020 - Oct 7, 2020
2020 IEEE International Conference on Quantum Computing and Engineering (QCE)
Broomfield, CO USA
Oct 12, 2020 - Oct 16, 2020
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Oct 21, 2020 - Oct 23, 2020
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
Singapore
Dec 2, 2020 - Dec 4, 2020
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Shenzhen, China
Dec 14, 2020 - Dec 16, 2020
2021 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Aalborg East, Denmark
Apr 28, 2021 - Apr 30, 2021
2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
DC, WA USA
Abstract Submission Date: Oct 30, 2020
May 3, 2021 - May 6, 2021
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
San Diego, CA USA
Jun 1, 2021 - Jun 4, 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 4, 2020
Jun 1, 2021 - Jun 4, 2021
2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
Osaka, Japan
Jun 21, 2021 - Jun 23, 2021
2020 International EOS/ESD Symposium on Design and System (IEDS)
Chengdu, SICHUAN, China
Jun 23, 2021 - Jun 25, 2021
2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)
San Antonio, TX USA
Oct 24, 2021 - Oct 27, 2021
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA
Abstract Submission Date: Oct 10, 2021
May 30, 2022 - Jun 4, 2022
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 8, 2020
May 27, 2024 - Jun 1, 2024
2025 IEEE 69th Holm Conference on Electrical Contacts (HLM)
San Antonio, TX USA
Oct 15, 2025 - Oct 22, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 8, 2025
May 25, 2026 - May 30, 2026
2027 IEEE 77th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA
Abstract Submission Date: Oct 8, 2026
May 31, 2027 - Jun 5, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC)
Grapevine, TX USA
Abstract Submission Date: Oct 10, 2027
May 29, 2028 - Jun 3, 2028