Upcoming Conferences

EPS Vice President, Conferences: Sam Karikalan

Important EPS Message on COVID-19 and Upcoming Conferences

Dear Members and Patrons of the IEEE Electronics Packaging Society,

With the health and safety of our members and participants being our first priority, please know that our thoughts are with those affected by the COVID-19 outbreak.

We are closely monitoring the developments related to this pandemic and working diligently with the IEEE and our conference organizing committees worldwide, on our preparedness. Some of the conferences sponsored by our society that are scheduled to be held during these challenging few months have been already rescheduled or canceled. Others are coming up in the later part of this year, and we are carefully watching the developments and ready to make swift decisions, as needed. 

The following is the current status of the EPS sponsored conferences in the remainder of 2020. This page will be updated on a weekly basis, as the situation keeps changing dynamically.

Status as of April 2, 2020


Conferences financially sponsored/co-sponsored by the EPS:


May 17-20, 2020

Cologne, Germany

Canceled; to be held at the same venue next year


May 26-29, 2020

Orlando, FL, USA

No Change – evaluating backup options


May 26-29, 2020

Orlando, FL, USA

No Change – evaluating backup options


Sep 15-18, 2020

Vestfold, Norway

No change


Sep 28-30, 2020

Putrajaya, Malaysia

No change


Oct 4-7, 2020

San Jose, CA, USA

No change


Oct 4-7, 2020

San Antonio, TX, USA

No change


Nov 9-7, 2020

Kyoto, Japan

No change


Dec 2-4, 2020


No change


Dec 14-16, 2020

Shenzhen, China

No change

Conferences technically sponsored/co-sponsored by the EPS:


Apr 26-29, 2020

Cracow, Poland

Postponed to July 5-8, 2020


May 4-7, 2020

Saratoga Springs, NY, USA

Postponed to August 23-25, 2020


May 13-17, 2020

Demanovska Valley, Slovakia

Virtual Conference May 14-15, 2020


May 19-22, 2020

Chengdu, China

Postponed to Nov 11-13, 2020


Jun 15-18, 2020

Rorschach, Switzerland

Cancelled. To be held June 6-11, 2021


Jun 22-24, 2020

Osaka U, Japan

Biennial - Postponed to Jun 21-23, 2021


Aug 12-15, 2020

Guangzhou, China

No Change – evaluating backup options

EOS/ESD Symposium

Sep 13-18, 2020

Reno, NV, USA

No change


Sep 23-25, 2020

Berlin, Germany

No Change


Sep 29-30, 2020

Amberg, Germany

No Change

QCE Oct 12-15, 2020 Denver, CO, USA No Change


Oct 21-23, 2020

Taipei, Taiwan

No change


Before traveling to any EPS sponsored conference, we recommend that you stay informed of any information your local health agencies and those at the conference location may make available and take reasonable precautions to protect yourself.

Other Resources:

World Health Organization - Coronavirus disease (COVID-19) advice for the public

Message from IEEE on Coronavirus (COVID-19) 

Resources for Conference Organizers


In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

NEW:  To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award. 



The following best/outstanding papers from ECTC 2019 will be available on Xplore as Open Access until June 1, 2020.

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

Low Temperature and Pressureless Microfluidic Electroless Bonding Process for Vertical Interconnection

A MEMS Microphone in a FOWLP

An Assessment of Electromigration in 2.5D Packaging  


2020 43rd International Spring Seminar on Electronics Technology (ISSE)
Liptovský Mikuláš, Slovakia
May 14, 2020 - May 15, 2020
IEEE Workshop on Signal & Power Integrity (SPI) To Be Held 2021
May 17, 2020 - May 20, 2020
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Lake Buena Vista, FL USA
May 26, 2020 - May 29, 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Lake Buena Vista, FL USA
May 26, 2020 - May 29, 2020
2020 30th International Conference on Electrical Contacts (ICEC)
Rorschach, Switzerland
Jun 15, 2020 - Jun 18, 2020
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Kraków, Poland
Jul 5, 2020 - Jul 8, 2020
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Guangzhou, China
Aug 12, 2020 - Aug 15, 2020
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA
Aug 23, 2020 - Aug 25, 2020
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
Tønsberg, Norway
Sep 15, 2020 - Sep 18, 2020
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Berlin, Germany
Abstract Submission Date: Apr 10, 2020
Sep 23, 2020 - Sep 25, 2020
2020 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
Kuala Lumpur, Malaysia
Sep 28, 2020 - Sep 30, 2020
2020 14th International Congress Molded Interconnect Devices (MID)
Amberg, Germany
Sep 29, 2020 - Sep 30, 2020
2020 66th IEEE Holm Conference on Electrical Contacts and Intensive Course (HLM)
San Antonio, TX USA
Sep 30, 2020 - Oct 7, 2020
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
San Jose, CA USA
Oct 4, 2020 - Oct 7, 2020
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Abstract Submission Date: Jun 15, 2020
Oct 21, 2020 - Oct 23, 2020
2020 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Abstract Submission Date: May 22, 2020
Nov 9, 2020 - Nov 11, 2020
2020 International EOS/ESD Symposium on Design and System (IEDS)
Chengdu, SICHUAN, China
Nov 11, 2020 - Nov 13, 2020
22nd Electronics Packaging Technology Conference (EPTC)
Abstract Submission Date: Jun 10, 2020
Dec 2, 2020 - Dec 4, 2020
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Shenzhen, China
Dec 14, 2020 - Dec 16, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 16, 2020
Jun 1, 2021 - Jun 4, 2021