Upcoming Conferences

EPS Vice President, Conferences: Tanja Braun

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

NEW:  To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award.  

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, Colorado USA
May 28, 2024 - May 31, 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Denver, Colorado USA
May 28, 2024 - May 31, 2024
2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Dresden, Germany
Jun 2, 2024 - Jun 5, 2024
2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Tampere, Finland
Jun 11, 2024 - Jun 13, 2024
2024 Electronics Goes Green 2024+ (EGG)
Berlin, Germany
Jun 18, 2024 - Jun 20, 2024
2024 15th International Conference on Computing Communication and Networking Technologies (ICCCNT)
Kamand, India
Jun 24, 2024 - Jun 28, 2024
2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS)
Tel Aviv, Israel
Jul 9, 2024 - Jul 11, 2024
2024 25th International Conference on Electronic Packaging Technology (ICEPT)
Tianjin, China
Aug 7, 2024 - Aug 9, 2024
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
Berlin, Germany
Sep 11, 2024 - Sep 13, 2024
2024 46th Annual EOS/ESD Symposium (EOS/ESD)
Reno, Nevada USA
Sep 16, 2024 - Sep 18, 2024
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Toulouse, France
Sep 25, 2024 - Sep 27, 2024
2024 International 3D Systems Integration Conference (3DIC)
Sendai, Japan
Abstract Submission Date: Jun 14, 2024
Sep 25, 2024 - Sep 27, 2024
2024 IEEE 69th Holm Conference on Electrical Contacts (HOLM)
Annapolis, Maryland USA
Oct 6, 2024 - Oct 10, 2024
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Toronto, Ontario Canada
Abstract Submission Date: Jun 14, 2024
Oct 6, 2024 - Oct 9, 2024
2024 IEEE 40th International Electronics Manufacturing Technology (IEMT)
Penang, Malaysia
Oct 16, 2024 - Oct 18, 2024
2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Abstract Submission Date: Jun 23, 2024
Oct 22, 2024 - Oct 25, 2024
2024 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Abstract Submission Date: May 31, 2024
Nov 13, 2024 - Nov 15, 2024
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
Singapore
Abstract Submission Date: May 31, 2024
Dec 3, 2024 - Dec 6, 2024
2025 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Tuscaloosa, Alabama USA
Apr 8, 2025 - Apr 10, 2025
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Dallas, Texas USA
Abstract Submission Date: Oct 8, 2024
May 26, 2025 - May 31, 2025
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Dallas, Texas USA
Abstract Submission Date: Sep 2, 2024
May 27, 2025 - May 30, 2025
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Grenoble, France
Abstract Submission Date: Jan 20, 2025
Sep 15, 2025 - Sep 18, 2025
2025 IEEE 70th Holm Conference on Electrical Contacts (HLM)
San Antonio, Texas USA
Oct 15, 2025 - Oct 22, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
San Diego, California USA
Abstract Submission Date: Oct 8, 2025
May 25, 2026 - May 30, 2026
2026 25th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, Florida USA
Abstract Submission Date: Sep 8, 2025
May 26, 2026 - May 29, 2026
2027 26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, Colorado USA
Abstract Submission Date: Sep 7, 2026
May 25, 2027 - May 28, 2027
2027 IEEE 77th Electronic Components and Technology Conference (ECTC)
Las Vegas, Nevada USA
Abstract Submission Date: Oct 8, 2026
May 31, 2027 - Jun 5, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC)
Texas, USA
Abstract Submission Date: Oct 10, 2027
May 29, 2028 - Jun 3, 2028
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Dallas, Texas USA
Abstract Submission Date: Sep 6, 2027
May 30, 2028 - Jun 2, 2028
2029 IEEE 79th Electronic Components and Technology Conference (ECTC)
Florida, USA
Abstract Submission Date: Sep 10, 2028
May 28, 2029 - Jun 2, 2029
2029 28th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, Florida USA
Abstract Submission Date: Sep 4, 2028
May 29, 2029 - Jun 1, 2029
2030 IEEE 80th Electronic Components and Technology Conference (ECTC)
Denver, Colorado USA
Abstract Submission Date: Oct 8, 2029
May 26, 2030 - Jun 1, 2030
2030 29th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, Colorado USA
Abstract Submission Date: Sep 3, 2029
May 28, 2030 - May 31, 2030
2031 IEEE 81st Electronic Components and Technology Conference (ECTC)
Dallas, Texas USA
Abstract Submission Date: Oct 11, 2030
May 22, 2031 - Jun 1, 2031
2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Dallas, Texas USA
Abstract Submission Date: Sep 2, 2030
May 27, 2031 - May 30, 2031