Upcoming Conferences

EP Vice President, Conferences:  Chris Bailey 

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)
Reno, NV USA
Sep 23, 2018 - Sep 28, 2018
2018 13th International Congress Molded Interconnect Devices (MID)
Würzburg, Germany
Sep 25, 2018 - Sep 26, 2018
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Stockholm, Sweden
Sep 26, 2018 - Sep 28, 2018
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
San Jose, CA USA
Oct 14, 2018 - Oct 17, 2018
2018 IEEE Holm Conference on Electrical Contacts
Albuquerque, NM USA
Oct 14, 2018 - Oct 18, 2018
2018 15th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)
Shenzhen, China
Oct 23, 2018 - Oct 25, 2018
2018 International Wafer Level Packaging Conference (IWLPC)
San Jose, CA USA
Oct 23, 2018 - Oct 25, 2018
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Oct 24, 2018 - Oct 26, 2018
2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Iasi, Romania
Oct 25, 2018 - Oct 28, 2018
2018 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Nov 19, 2018 - Nov 21, 2018
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
Singapore
Dec 4, 2018 - Dec 7, 2018
2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Chandigarh, India
Dec 16, 2018 - Dec 18, 2018
2018 20th International Conference on Electronic Materials and Packaging (EMAP)
Hong Kong
Dec 17, 2018 - Dec 20, 2018
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Hannover, Germany
Abstract Submission Date: Oct 30, 2018
Mar 24, 2019 - Mar 27, 2019
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Toulouse, France
Abstract Submission Date: Nov 17, 2018
Apr 24, 2019 - Apr 26, 2019
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA
Abstract Submission Date: Oct 9, 2018
May 6, 2019 - May 9, 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA
Abstract Submission Date: Oct 19, 2018
May 25, 2019 - Jun 2, 2019
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Las Vegas, NV USA
May 29, 2019 - May 31, 2019
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI)
Chambéry, France
Jun 18, 2019 - Jun 21, 2019
2019 IEEE Holm Conference on Electrical Contracts
Milwaukee, WI USA
Abstract Submission Date: Feb 8, 2019
Sep 14, 2019 - Sep 18, 2019
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Pisa, Italy
Abstract Submission Date: Jan 15, 2019
Sep 16, 2019 - Sep 19, 2019
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Lake Buena Vista, FL USA
Abstract Submission Date: Jul 1, 2019
May 26, 2020 - May 29, 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Lake Buena Vista, FL USA
Abstract Submission Date: Oct 18, 2019
May 26, 2020 - May 29, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 16, 2020
Jun 1, 2021 - Jun 4, 2021