Upcoming Conferences

EPS Vice President, Conferences: Sam Karikalan

Important EPS Message on COVID-19 and Upcoming Conferences

Dear Members and Patrons of the IEEE Electronics Packaging Society,

As always the health and safety of our members and participants is our first priority. Please know that our thoughts are with those affected by the COVID-19 outbreak.

We will continue to closely monitor the developments related to this pandemic and work diligently with the IEEE and our conference organizing committees worldwide on our preparedness. Please reference the IEEE MCE Health and Safety page for the latest information.

Before traveling to any EPS sponsored conference, we recommend that you stay informed of any information your local health agencies and those at the conference location may make available and take reasonable precautions to protect yourself.


Other Resources:

World Health Organization - Coronavirus disease (COVID-19) advice for the public

Resources for Conference Organizers

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

NEW:  To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award.  

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Singapore, Singapore
Dec 7, 2022 - Dec 9, 2022
24th Electronics Packaging Technology Conference (EPTC)
Singapore
Dec 7, 2022 - Dec 9, 2022
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Urbana, IL USA
Dec 12, 2022 - Dec 14, 2022
2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)
Suzhou, China
Dec 18, 2022 - Dec 21, 2022
2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
Miami, FL USA
Feb 1, 2023 - Feb 3, 2023
2023 IEEE Design and Technology of Modern Electronic Systems (DTMES)
Addis Ababa, Ethiopia
Feb 6, 2023 - Feb 8, 2023
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Graz, Austria
Apr 16, 2023 - Apr 19, 2023
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA
May 1, 2023 - May 4, 2023
2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)
Aveiro, Portugal
May 7, 2023 - May 10, 2023
2023 46th International Spring Seminar on Electronics Technology (ISSE)
Timisoara, Romania
Abstract Submission Date: Jan 16, 2023
May 10, 2023 - May 14, 2023
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Orlando, FL USA
May 29, 2023 - Jun 3, 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, FL USA
May 30, 2023 - Jun 2, 2023
2023 14th International Conference on Computing Communication and Networking Technologies (ICCCNT)
New Delhi, India
Jul 6, 2023 - Jul 8, 2023
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Cambridge, United Kingdom
Abstract Submission Date: Jan 27, 2023
Sep 11, 2023 - Sep 14, 2023
2023 45th Annual EOS/ESD Symposium (EOS/ESD)
Riverside, CA USA
Abstract Submission Date: Feb 6, 2023
Oct 1, 2023 - Oct 6, 2023
2023 IEEE 68th Holm Conference on Electrical Contacts (HOLM)
WA, USA
Oct 3, 2023 - Oct 12, 2023
2023 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS)
Tel Aviv, Israel
Abstract Submission Date: Apr 18, 2023
Nov 6, 2023 - Nov 8, 2023
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Denver, CO USA
May 27, 2024 - Jun 1, 2024
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, CO USA
Abstract Submission Date: Sep 4, 2023
May 28, 2024 - May 31, 2024
2024 IEEE 69th Holm Conference on Electrical Contacts (HOLM)
MD, USA
Oct 6, 2024 - Oct 10, 2024
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Dallas, TX USA
Abstract Submission Date: Oct 8, 2024
May 26, 2025 - May 31, 2025
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Grapevine, TX USA
Abstract Submission Date: Sep 2, 2024
May 27, 2025 - May 30, 2025
2025 IEEE 70th Holm Conference on Electrical Contacts (HLM)
San Antonio, TX USA
Oct 15, 2025 - Oct 22, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 8, 2025
May 25, 2026 - May 30, 2026
2026 25th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, FL USA
Abstract Submission Date: Sep 8, 2025
May 26, 2026 - May 29, 2026
2027 26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, CO USA
Abstract Submission Date: Sep 7, 2026
May 25, 2027 - May 28, 2027
2027 IEEE 77th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA
Abstract Submission Date: Oct 8, 2026
May 31, 2027 - Jun 5, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC)
Grapevine, TX USA
Abstract Submission Date: Oct 10, 2027
May 29, 2028 - Jun 3, 2028
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Grapevine, TX USA
Abstract Submission Date: Sep 6, 2027
May 30, 2028 - Jun 2, 2028
2029 IEEE 79th Electronic Components and Technology Conference (ECTC)
Orlando, FL USA
Abstract Submission Date: Sep 10, 2028
May 28, 2029 - Jun 2, 2029
2029 28th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, FL USA
Abstract Submission Date: Sep 4, 2028
May 29, 2029 - Jun 1, 2029
2030 IEEE 80th Electronic Components and Technology Conference (ECTC)
Aurora, CO USA
Abstract Submission Date: Oct 8, 2029
May 26, 2030 - Jun 1, 2030
2030 29th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, CO USA
Abstract Submission Date: Sep 3, 2029
May 28, 2030 - May 31, 2030