Upcoming Conferences

EPS Vice President, Conferences: Sam Karikalan

Important EPS Message on COVID-19 and Upcoming Conferences

Dear Members and Patrons of the IEEE Electronics Packaging Society,

With the health and safety of our members and participants being our first priority, please know that our thoughts are with those affected by the COVID-19 outbreak.

We are closely monitoring the developments related to this pandemic and working diligently with the IEEE and our conference organizing committees worldwide, on our preparedness. Some of the conferences sponsored by our society that are scheduled to be held during these challenging few months have been already rescheduled or canceled. Others are coming up in the later part of this year, and we are carefully watching the developments and ready to make swift decisions, as needed. 

This page will be updated on a weekly basis, as the situation keeps changing dynamically.

Status as of July 19, 2021

Conferences financially sponsored/co-sponsored by the EPS:

Conferences technically sponsored/co-sponsored by the EPS:

ESTC Not held in 2021 MID Virtual Event Feb 8-11, 2021

IWIPP

Postponed to Aug 24-26, 2022

SEMI-THERM

Virtual Event March 22-26, 2021

IEMT

Canceled

EuroSimE

Virtual Event April 19-21, 2021

SPI

Virtual Event May 10-12, 2021

SSI

Virtual Event April 27-29, 2021

ECTC Virtual Event June 1-July 4, 2021 ISSE In-person Event Bautzen, Germany May 5-9, 2021

ITHERM

Virtual Event June 1-4, 2021 

ASMC

Virtual Event  May 10-12, 2021

EPEPS

Virtual Event  Austin, TX

Oct 17-20, 2021

3D-PEIM

Virtual Event June 21-23, 2021

HOLM

Hybrid Event San Antonio, TX Oct 24-27, 2021

IEDS

In-person Event Chengdu, China June 23-25, 2021

ICSJ 

Hybrid Event, Kyoto, Japan

Nov 10-12, 2021

 

ICEPT

In-person Event Xiamen, China Aug 11-14, 2021

REPP

Hybrid Event Silicon Valley, CA Nov 11, 2021 - Nov 12, 2021

DTIP Virtual Event Aug 25-27, 2021

 3DIC

 

Hybrid Event Raleigh, NC

Nov 15-18, 2021

EMPC

Virtual Event, Sept 13-16, 2021

EPTC

Virtual Event Dec 1-3, 2021

THERMINIC

In-person Event Berlin, Germany Sept 22-24, 2021

EDAPS

Virtual Event Urbana, IL

Dec13-15, 2021

EOS/ESD Symposium

In-person Event Tucson, AZ Sept 26-Oct 1, 2021

 

QCE

 

Virtual Event Oct 18-22, 2021

 

IMPACT

In-person Event Taipei, Taiwan Oct 20-22, 2021

COMCAS In-person Event Tel Aviv, Israel Nov 1-3, 2021

SSLChina: IFWS

In-person Event Guangdong, China Nov 28-30, 2021

 


 

 

 

 Before traveling to any EPS sponsored conference, we recommend that you stay informed of any information your local health agencies and those at the conference location may make available and take reasonable precautions to protect yourself.


Other Resources:

World Health Organization - Coronavirus disease (COVID-19) advice for the public

Message from IEEE on Coronavirus (COVID-19) 

Resources for Conference Organizers

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

NEW:  To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award.  

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
China
Aug 11, 2021 - Aug 14, 2021
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Sweden
Sep 13, 2021 - Sep 16, 2021
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Berlin, Germany
Sep 22, 2021 - Sep 24, 2021
2021 43rd Annual EOS/ESD Symposium (EOS/ESD)
Tucson, AZ USA
Sep 26, 2021 - Oct 1, 2021
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Austin, TX USA
Oct 17, 2021 - Oct 20, 2021
2021 IEEE International Conference on Quantum Computing and Engineering (QCE)
Broomfield, CO USA
Oct 18, 2021 - Oct 22, 2021
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Oct 20, 2021 - Oct 22, 2021
2021 IEEE 67th Holm Conference on Electrical Contacts (HLM)
San Antonio, TX USA
Oct 24, 2021 - Oct 27, 2021
2021 IEEE International 3D Systems Integration Conference (3DIC)
CA, USA
Oct 26, 2021 - Oct 29, 2021
2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)
Tel Aviv, Israel
Nov 1, 2021 - Nov 3, 2021
2021 10th IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Nov 10, 2021 - Nov 12, 2021
2021 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)
Milpitas, CA USA
Abstract Submission Date: Aug 20, 2021
Nov 11, 2021 - Nov 12, 2021
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Singapore
Dec 1, 2021 - Dec 3, 2021
2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Urbana, IL USA
Dec 13, 2021 - Dec 15, 2021
2022 IEEE Design and Technology of Modern Electronic Systems (DTMES)
Addis Ababa, Ethiopia
Abstract Submission Date: Oct 8, 2021
Feb 8, 2022 - Feb 10, 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 10, 2021
May 30, 2022 - Jun 4, 2022
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
San Diego, CA USA
Abstract Submission Date: Sep 6, 2021
May 31, 2022 - Jun 3, 2022
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Aalborg East, Denmark
Aug 24, 2022 - Aug 26, 2022
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
TX, USA
Abstract Submission Date: Oct 10, 2022
May 29, 2023 - Jun 3, 2023
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
May 27, 2024 - Jun 1, 2024
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Orlando, FL USA
Abstract Submission Date: Oct 8, 2024
May 26, 2025 - May 31, 2025
2025 IEEE 69th Holm Conference on Electrical Contacts (HLM)
San Antonio, TX USA
Oct 15, 2025 - Oct 22, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 8, 2025
May 25, 2026 - May 30, 2026
2027 IEEE 77th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA
Abstract Submission Date: Oct 8, 2026
May 31, 2027 - Jun 5, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC)
Grapevine, TX USA
Abstract Submission Date: Oct 10, 2027
May 29, 2028 - Jun 3, 2028
2029 IEEE 79th Electronic Components and Technology Conference (ECTC)
Orlando, FL USA
Abstract Submission Date: Sep 10, 2028
May 28, 2029 - Jun 2, 2029
23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Virtual Conference
Sep 13, 2021 - Sep 16, 2021