Upcoming Conferences

EPS Vice President, Conferences: Sam Karikalan

Important EPS Message on COVID-19 and Upcoming Conferences

Dear Members and Patrons of the IEEE Electronics Packaging Society,

With the health and safety of our members and participants being our first priority, please know that our thoughts are with those affected by the COVID-19 outbreak.

We are closely monitoring the developments related to this pandemic and working diligently with the IEEE and our conference organizing committees worldwide, on our preparedness. Some of the conferences sponsored by our society that are scheduled to be held during these challenging few months have been already rescheduled or canceled. Others are coming up in the later part of this year, and we are carefully watching the developments and ready to make swift decisions, as needed. 

This page will be updated on a weekly basis, as the situation keeps changing dynamically.

Status as of May 17, 2022

Conferences financially sponsored/co-sponsored by the EPS:

Conferences technically sponsored/co-sponsored by the EPS:

DTMES

Feb 7 - 9, 2022

Addis Ababa, Ethiopa

EuroSimE

April 25 - April 27, 2022 

St. Julian, Malta

SPI

May 22 - 25, 2022

Siegen, Germany

ASMC

May 2 - 5, 2022

Saratoga Springs, NY, USA

ITHERM

May 31 - June 3, 2022

San Diego, CA

ISSE

May 11 - 15, 2022

Vienna, Austria

ECTC 

May 31 - June 3, 2022

San Diego, CA

EOS/ESD Symposium

Sept 18 - 23, 2022

Reno, NV, USA

IWIPP

Aug 24 - 26, 2022

Grenoble, France

ICCCNT

Oct 3 - Oct 5, 2022

Kharagpur, India

ESTC

Sept 13–16, 2022 Sibiu, Romania

IEMT 

Oct 19 - 21, 2022

Malaysia

EPEPS

Oct 9 - 12, 2022

San Jose, CA, USA

HLM

Oct 23 -  26, 2022

Tampa, FL, USA

EPTC

Dec 7 -  9, 2022

Singapore

 

Before traveling to any EPS sponsored conference, we recommend that you stay informed of any information your local health agencies and those at the conference location may make available and take reasonable precautions to protect yourself.


Other Resources:

World Health Organization - Coronavirus disease (COVID-19) advice for the public

Message from IEEE on Coronavirus (COVID-19) 

Resources for Conference Organizers

In pursuit of its mission to promote close cooperation and exchange of technical information among its members and others, the EPS sponsors and supports a number of global and regional conferences, workshops and other techical meetings within its field of interest. 

All of these events provide valuable opportunities for presenting, learning about, and discussing the latest technical advances as well as networking with colleagues.  Many produce publications that are available through IEEE Xplore.

NEW:  To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award.  

2022 IEEE 26th Workshop on Signal and Power Integrity (SPI)
Siegen, Germany
May 22, 2022 - May 25, 2022
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
San Diego, CA USA
May 31, 2022 - Jun 3, 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
May 31, 2022 - Jun 3, 2022
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Dalian, China
Aug 10, 2022 - Aug 13, 2022
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Grenoble, France
Aug 24, 2022 - Aug 26, 2022
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
Sibiu, Romania
Sep 13, 2022 - Sep 16, 2022
2022 44th Annual EOS/ESD Symposium (EOS/ESD)
Reno, NV USA
Sep 18, 2022 - Sep 23, 2022
2022 13th International Conference on Computing Communication and Networking Technologies (ICCCNT)
Kharagpur, India
Oct 3, 2022 - Oct 5, 2022
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
San Jose, CA USA
Oct 9, 2022 - Oct 12, 2022
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
Putrajaya, Malaysia
Oct 19, 2022 - Oct 21, 2022
2022 IEEE 67th Holm Conference on Electrical Contacts (HLM)
Tampa, FL USA
Oct 23, 2022 - Oct 26, 2022
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Abstract Submission Date: Jun 24, 2022
Oct 26, 2022 - Oct 28, 2022
2022 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Abstract Submission Date: May 29, 2022
Nov 9, 2022 - Nov 11, 2022
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Singapore
Abstract Submission Date: Jun 15, 2022
Dec 7, 2022 - Dec 9, 2022
2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
Miami, FL USA
Abstract Submission Date: Jul 11, 2022
Feb 1, 2023 - Feb 3, 2023
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
TX, USA
Abstract Submission Date: Oct 10, 2022
May 29, 2023 - Jun 3, 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, FL USA
Abstract Submission Date: Sep 5, 2022
May 30, 2023 - Jun 2, 2023
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Cambridge, United Kingdom
Abstract Submission Date: Jan 27, 2023
Sep 11, 2023 - Sep 14, 2023
2023 IEEE 68th Holm Conference on Electrical Contacts (HOLM)
WA, USA
Oct 3, 2023 - Oct 12, 2023
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
May 27, 2024 - Jun 1, 2024
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, CO USA
Abstract Submission Date: Sep 4, 2023
May 28, 2024 - May 31, 2024
2024 IEEE 69th Holm Conference on Electrical Contacts (HOLM)
MD, USA
Oct 6, 2024 - Oct 10, 2024
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Orlando, FL USA
Abstract Submission Date: Oct 8, 2024
May 26, 2025 - May 31, 2025
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Grapevine, TX USA
Abstract Submission Date: Sep 2, 2024
May 27, 2025 - May 30, 2025
2025 IEEE 70th Holm Conference on Electrical Contacts (HLM)
San Antonio, TX USA
Oct 15, 2025 - Oct 22, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
San Diego, CA USA
Abstract Submission Date: Oct 8, 2025
May 25, 2026 - May 30, 2026
2026 25th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, FL USA
Abstract Submission Date: Sep 8, 2025
May 26, 2026 - May 29, 2026
2027 26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, CO USA
Abstract Submission Date: Sep 7, 2026
May 25, 2027 - May 28, 2027
2027 IEEE 77th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA
Abstract Submission Date: Oct 8, 2026
May 31, 2027 - Jun 5, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC)
Grapevine, TX USA
Abstract Submission Date: Oct 10, 2027
May 29, 2028 - Jun 3, 2028
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Grapevine, TX USA
Abstract Submission Date: Sep 6, 2027
May 30, 2028 - Jun 2, 2028
2029 IEEE 79th Electronic Components and Technology Conference (ECTC)
Orlando, FL USA
Abstract Submission Date: Sep 10, 2028
May 28, 2029 - Jun 2, 2029
2029 28th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, FL USA
Abstract Submission Date: Sep 4, 2028
May 29, 2029 - Jun 1, 2029
2030 IEEE 80th Electronic Components and Technology Conference (ECTC)
Aurora, CO USA
Abstract Submission Date: Oct 8, 2029
May 26, 2030 - Jun 1, 2030
2030 29th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Aurora, CO USA
Abstract Submission Date: Sep 3, 2029
May 28, 2030 - May 31, 2030