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- Intel AgilexTM Direct Radio Frequency Multi Chip Package with Embedded Multi-Die Interconnect Bridge – The First State-of-The-Art Heterogeneous Integrated Multi-Chip Package
- A Novel Package-Integrated Ceramic Cyclone Cooler for the Thermal Management of High- Energy Lasers
- Flexible Hybrid Electronics with 3DIC
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- August 2023
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- Call for Papers Deadline Extended: T-CPMT Special Section on Power Electronics Packaging
- 34th Annual Electronics Packaging Symposium
- EDAPS 2023 Call For Papers Submission Deadline Extended
- Chiplets for Automotive – Are We There Yet?
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- July 2023
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- Congratulations to the 2024 IEEE Rao R. Tummala Electronics Packaging Award Recipient
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- June 2023
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- Distinguished Lecture by Dr. John H. Lau: Chiplet Design and Heterogeneous Integration Packaging
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- Heterogeneous Integration Session at SEMICON West 2023
- May 2023
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- Reliability Concerns in Through Silicon Via based 3D Integration: Fabrication to Packaging
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- 25th Electronics Packaging Technology Conference (EPTC 2023)
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- Impact of Thermal Congestion on Advanced Package Test
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- April 2023
- Fourth Annual REPP 2023 Call for Papers
- IEEE Glass Packaging Workshop
- Utah Section Proposes IEEE Milestone for Early Computer Graphics Work in Utah
- Top T-CPMT Papers on Xplore
- Upcoming EPS Webinar on Smart Lighting
- EPS Member at Large Nominations To Open 1 May, 2023
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- Architecting Chiplets for Product Manufacturing Test Resiliency
- HIR Workshop at ECTC and ITherm 2023
- March 2023
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- ECTC 2022 Best Papers Available as Open Access
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- Additive manufacturing for nano-feature applications: Electrohydrodynamic printing as a next-generation enabling technology
- X-Ray Radiography Study of The Evolution of Defects in Solder Joints*
- Heterogeneous Integration Technologies for Scaled Quantum Information Processing Systems
- February 2023
- December 2022
- 2023 IEEE Rao R. Tummala Electronics Packaging Award Recipient
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- Biodegradable and nanocomposite substrates: new prospects for sustainable electronics packaging
- High Performance Graphene Enhanced Thermal Interface Technology for Electronics Cooling Applications
- IEEE EPS 73rd ECTC – Conference Organizing Meeting
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