Technical Committees

EPS Vice President, Technology:  David McCann

 

The Technology Functional Team's guiding purpose is to develop content and collaboratively participate cross-funcationally for advancement and learning in our packaging and test community.

To achieve this, we have functional area Technical Committees.  

Technical committees are organized around the following areas:  3D/TSV; Electrical Design Modeling, and Simulation; Emerging Technologies; High Density Substrates; Materials and Processes; Nanotechnology; Photonics; Power and Energy; Reliability; RF, High Speed, Components and Systems; Test, Thermal and Mechanical.  Please visit the web sites of these committees using the links below to learn more.

Technical Committees create webinars, write and publish articles in the monthly EPS Newsletter, participate in HIR (EPS Heterogenous Integration Roadmaps), participate on EPS conference program committees (ex:  ECTC Photonics), and support conferences and symposiums across our Packaging and Test industry.  

For some conferences (ex: REPP, 3DIC), the Technical Committee provides event leadership.  In most cases, the Technical Committees lead technical sessions in the conferences.  Conference and symposium support is not limited to EPS or other IEEE events (ex:  ASME).  Members also contribute to standards committees (ex:  chipsets).

 We ask that you be an EPS member to participate in the Technical Committees but this is not required.  

Technical committees meet monthly.  If you would like to become a member, send your resume to the appropriate Technical Committee (see links below).

 Links to further information:

·  Technology Functional Team Goals

·  EPS Newsletters 

·  HIR (Heterogenous Integration Roadmap)

·  IEEE Global Semiconductors

 Regards,

David McCann, EPS VP Technology

Technical Committees

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