IEEE Electronics Packaging Society IEEE Electronics Packaging Society

PhD Fellowship

EPS Announces a New PhD Fellowship Award

Nomination Period Now Closed for 2020 EPS PhD Fellowship

 

Description/Objective
To promote, recognize, and support PhD level study and research within the Electronics Packaging Society’s field of interest.

Prize

A plaque and a single annual award of US$5,000, applicable towards the student’s research.

Eligibility

Candidate must be an IEEE EPS member, at the time of nomination, and be pursuing a doctorate degree within the EPS field of interest on a full-time basis from an accredited graduate school or institution. The candidate must have studied with her/his advisor for at least 1 year, at the time of nomination, to be eligible.
A Student who received a Fellowship award from another IEEE Society, within the same year, or is a previous EPS Fellowship winner is ineligible.

Schedule

  • On-Line application available by September 15
  • Complete application packages are due by January 21
  • Recipients will be notified by mid March 
  • Formal award presentations will take place at the IEEE EPS luncheon at ECTC at the end of May.
  • Monetary awards will be given by June 15 (or at ECTC)

Selection/Basis for Judging:

Demonstration of his/her significant ability to perform independent research in the fields of electronic packaging and a proven history of academic excellence, as documented in:
  • Nomination by an IEEE EPS Member. Only one nomination per member per year.
  • Two-page (maximum) statement by the student describing his or her education and
  • Research interests, accomplishments, and impact on the electronics package industry.
  • Proof of contributions to the community may consist of open literature publications (preferred) such as papers, patents, books, and conference presentations and reports (available to the public).
  • At least one letter of recommendation from someone familiar with the student’s work
  • Student resume

 

2019 RECIPIENT

SivaChandra Jangam

University of California, Los Angeles

For contributions to the development of the Silicon Interconnect Fabric as a platform for the fine pitch integration of heterogeneous chips.