Bio Lee

RICKY LEE (M’00, SM’03, F’08)received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. Currently he is Chair Professor of Mechanical and Aerospace Engineering at the Hong Kong University of Science and Technology (HKUST). He also holds a concurrent appointment as the acting Dean of the Systems Hub at the HKUST Guangzhou Campus.

 

In the past two decades, Ricky served in a number of leadership positions of IEEE EPS (formerly CPMT) Society, including President of CPMT, Member of Board of Governors, Editor-in-Chief of IEEE Transactions on CPMT, Chair of IEEE EPS Technical Field Award Committee, and Chair of IEEE CPMT HK Chapter. He is the recipient of IEEE EPS Outstanding Sustained Technical Contribution Award, David Feldman Outstanding Contribution Award, and Electronics Manufacturing Technology Award. Since July 2020, Ricky serves as the Editor-in-Chief of ASME Journal of Electronic Packaging.