Upcoming Emerging Technology TC Webinar
Title: Metallization of glass core and through-glass vias
Date: April 18, 2024
Time: 12:00 PM ET
Presenter: Jobert van Eisden
Register Here
Abstract:
As glass is gaining a lot of attention and momentum as a state of the art semiconductor packaging technology, industry is looking to complete the supply chain to enable this promising technology. Several advances have been made in the field of metallizing glass core through vias, and in today’s presentation, we will discuss several options and MKS’ take on delivering a manufacturable solution. We will discuss options for seed layer deposition and highlight the MKS wet metallization technique that allows us to directly plate on glass. We will also go over several options for electrolytic plating of the bulk copper conductor for the through glass vias.
Bio:
Jobert van Eisden is the OEM technology exchange director for the Americas. He is located in the Albany, NY region and has been with Atotech, now MKS Instrumentsfor 16 years where he specializes in technology development of wet metallization techniques for semiconductor and advanced packaging applications.