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Term 1 January, 2025 through 31 December, 2027


The EPS Board of Governors (BoG) includes 19 Members-at-Large, elected by the full voting membership of the Society. Six Members at Large will be selected each year to represent the regional composition of the Society membership and one Member at Large will be selected to represent the Young Professional community . A Young Professional is an individual that has completed their first academic degree within the last 15 years.

Regional Members-at-Large are elected to achieve totals proportionate to the geographic distribution of EPS members. Any IEEE Region/grouping of Regions determined to have at least 10% of total EPS members will have the proportional number of Member-at-Large positions designated to it for representation on the BoG.  The slate of candidates for each year’s election will be constructed to ensure that the resulting total of newly elected Members-at-Large and continuing Members-at-Large, respectively, has the proper proportion of representatives from each Region/grouping of Regions. Each Region/grouping of Regions will have a separate slate of candidates from that Region. Voting members will elect members-at-large from within their Region only (that is, members  in Region 1-7 & 9 vote for Members-at-Large from Region 1-7 & 9, members in Region 8 vote for Members-at-Large from Region 8, members in Region 10 vote for Members-at-Large from Region 10; etc.)

The nomination period for the EPS Distinguished Achievement Certificates is now open.  Nominations are accepted two times per year: Jan 1 - June 30 and Aug 30 - Oct 31.

More details can be found here. 

         Cert of Dist Achievement Pro Engagement 2 2024              Cert Dist Achievement Tech Leadership Feb 2024

T CPMT Podcast series graphic

Hosted by Wendem Beyene, the second T-CPMT podcast with Professor Michel Nakhla, discusses Signal and Power integrity Analysis: Breaking the Mold Beyond SPICE.

View the podcast on IEEEtv here

EPS would like to recognize EPS members for their outstanding achievements:

Daniel Donohoe:

Recipient of the  2024 Grainger College of Engineering Alumni Award for Distinguished Service received from the Industrial and Enterprise Systems Engineering Department. This award is conferred upon exceptional alumni each year. 

"For his distinguished career specializing in mechanical and materials engineering for electronics spanning corporate, civilian, military and entrepreneurial experience with exceptional service to the Air Force, IEEE and the ISE department."


Sreekant Narumanchi (Thermal & Mechanical Technical Committee Chair):

For achieving National Renewable Energy Laboratory's (NREL) Distinguished Member of Research Staff (DMRS) designation.

"For technical contributions and leadership in advanced packaging, thermal management and reliability for power electronics and electric machines for electric-drive vehicles, and numerous energy efficiency, and renewable energy applications."

Title: Metallization of glass core and through-glass vias

Date: April 18, 2024

Time: 12:00 PM ET

Presenter: Jobert van Eisden

Register Here


As glass is gaining a lot of attention and momentum as a state of the art semiconductor packaging technology, industry is looking to complete the supply chain to enable this promising technology. Several advances have been made in the field of metallizing glass core through vias, and in today’s presentation, we will discuss several options and MKS’ take on delivering a manufacturable solution. We will discuss options for seed layer deposition and highlight the MKS wet metallization technique that allows us to directly plate on glass. We will also go over several options for electrolytic plating of the bulk copper conductor for the through glass vias.


 Jobert van Eisden is the OEM technology exchange director for the Americas. He is located in the Albany, NY region and has been with Atotech, now MKS Instrumentsfor 16 years where he specializes in technology development of wet metallization techniques for semiconductor and advanced packaging applications.

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EPTC First Call for Papers

The 26th IEEE Electronics Packaging Technology Conference (EPTC2024) is aninternational event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsoredby the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC hasbeen established as a highly reputable international electronics packaging conference and is theIEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the completespectrum of electronics packaging technology. Topics include modules, components, materials,equipment technology, assembly, reliability, interconnect design, device and systems packaging,heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI.EPTC2024 will feature keynotes, technical sessions, invited talks, panels, workshops,exhibitions, and networking activities.

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The 13th International 3D Systems Integration Conference 

September 25th – 27th, 2024, Sendai, Japan

1st Call for Papers

The 13th IEEE International 3D Systems Integration Conference 2024 (3DIC2024) will be held from September 25 (Wed.) to 27 (Fri.), 2024, at Hotel Metropolitan Sendai and Sendai Kokusai Hotel.

This conference is a continuation of the first international conference on 3DIC held in Japan, 3D-SIC2007, in March 2007 under the auspices of the Advanced Science and Engineering Technology Development Organization (ASET). Since 2009, the conference has been held annually in Japan, Europe, and the United States in rotation, sponsored by the IEEE. The research on 3D-IC/Chiplet and system integration requires a wide range of knowledge. Therefore, we will continue to develop and implement 3D-IC/Chiplet and system integration. This conference enables active discussions that transcend specialized areas, encourages dedicated participation by professionals and young researchers, and aims to develop this. The Best Young Researcher or Student Award will be presented on the final day. We believe that many of you will contribute to the conference.

The deadline for abstract submission is June 14, 2024.

Please submit one page of text (500 words) and one page of figures as an abstract.

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The IEEE Transactions on Components, Packaging, and Manufacturing Technology (T-CPMT) is a flagship journal focused on advancing the knowledge and dissemination of research on semiconductor packaging technologies.

T-CPMT is pleased to announce a Call for Papers for a Special Section on Frontiers of Photonic Integration and Packaging for communications, computing, AI/ML, sensing and quantum applications.

Authors should select "Special Section on Photonics Packaging" when submitting their papers and noting the same in their cover letter to ensure that the manuscript is assigned correctly.

The timeline for this Special Section is:

Deadline for submission of manuscripts: July 8, 2024

Final manuscripts due: September 30, 2024

Publication (target): November 2024

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The sponsor/exhibitor packages for EPEPS 2024 have been released!

EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems. Over four days, the conference will feature the latest advancements in CAD, design, and measurement techniques for:

• ensuring signal, power and thermal integrity in high-speed systems;

• optimizing performance in high-speed, RF, wireless and quantum systems.

EPEPS 2024 will be held in the gorgeous city of Toronto, the fastest growing tech hub in North America, close to prominent microelectronic companies, and home to a large talent pool of 400,000+ post-secondary students.

With over 100 participants from industry and academia, we think that EPEPS will be an excellent opportunity for your organization to promote its products or services, strengthen its brand recognition in the leading international venue in the area, connect with experts and potential customers, and recruit top talents.

Promote your latest products and recruit top talent at the premier international conference on electrical performance of interconnects, packages, systems.

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13th IEEE CPMT Symposium Japan (ICSJ2024)

“Innovation of Packaging Technology for Advanced Heterogeneous Integration” 

November 13 -15, 2024,

Ritsumeikan University Suzaku Campus, Kyoto, JAPAN



IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. ICSJ provides a platform for you to communicate and interact with global leaders in packaging technology. ICSJ2024 is only on-site conference.

Innovation of Packaging Technology for Advanced Heterogeneous Integration: Semiconductor devices have contributed to the development of various fields including PCs, because the pursuit of miniaturization (More Moore) has made it possible to simultaneously meet the demands for high speed, lower power consumption, and lower cost. 

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