IEEE 3DIC 2024 First Call for Papers
The 13th International 3D Systems Integration Conference
September 25th – 27th, 2024, Sendai, Japan
1st Call for Papers
The 13th IEEE International 3D Systems Integration Conference 2024 (3DIC2024) will be held from September 25 (Wed.) to 27 (Fri.), 2024, at Hotel Metropolitan Sendai and Sendai Kokusai Hotel.
This conference is a continuation of the first international conference on 3DIC held in Japan, 3D-SIC2007, in March 2007 under the auspices of the Advanced Science and Engineering Technology Development Organization (ASET). Since 2009, the conference has been held annually in Japan, Europe, and the United States in rotation, sponsored by the IEEE. The research on 3D-IC/Chiplet and system integration requires a wide range of knowledge. Therefore, we will continue to develop and implement 3D-IC/Chiplet and system integration. This conference enables active discussions that transcend specialized areas, encourages dedicated participation by professionals and young researchers, and aims to develop this. The Best Young Researcher or Student Award will be presented on the final day. We believe that many of you will contribute to the conference.
The deadline for abstract submission is June 14, 2024.
Please submit one page of text (500 words) and one page of figures as an abstract.