Call for Papers: Special Section on Frontiers of Photonic Integration and Packaging

The IEEE Transactions on Components, Packaging, and Manufacturing Technology (T-CPMT) is a flagship journal focused on advancing the knowledge and dissemination of research on semiconductor packaging technologies.

T-CPMT is pleased to announce a Call for Papers for a Special Section on Frontiers of Photonic Integration and Packaging for communications, computing, AI/ML, sensing and quantum applications.

Authors should select "Special Section on Photonics Packaging" when submitting their papers and noting the same in their cover letter to ensure that the manuscript is assigned correctly.

The timeline for this Special Section is:

Deadline for submission of manuscripts: July 8, 2024

Final manuscripts due: September 30, 2024

Publication (target): November 2024

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