EPTC 2024 First Call for Papers
The 26th IEEE Electronics Packaging Technology Conference (EPTC2024) is aninternational event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsoredby the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC hasbeen established as a highly reputable international electronics packaging conference and is theIEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the completespectrum of electronics packaging technology. Topics include modules, components, materials,equipment technology, assembly, reliability, interconnect design, device and systems packaging,heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI.EPTC2024 will feature keynotes, technical sessions, invited talks, panels, workshops,exhibitions, and networking activities.