EPS Certificate Program

In order to further the education of Electronics Packaging Society (EPS) members, the EPS is now offering a Certificate Program. The goal of the program is to give members new to electronics packaging an opportunity for further packaging education, offer continuous education in electronics packaging to existing members, and also to offer students electronics packaging training if they are in a University program that does not include packaging education.

Criteria: Must be an IEEE Electronics Packaging Society Member

To receive your certificate, 15 professional development hours (PDHs) must be completed. This can be obtained from a combination of the following:

1). IEEE EPS Webinar (1 PDH) – must complete PDH evaluation

2). Professional Development Courses – must complete survey and CEU credit form. Previous ECTC PDCs from the last 10 years can be used towards this if the CEU application was completed at the time of the course. PDCs from ESTC and EPTC 2018 and forward can be used.

- Electronic Components and Technology Conference (USA)  = 4 PDHs

- Electronic Systems-Integration Technology Conference (Europe) = 3 PDHs

- Electronic Packaging Technology Conference (Asia) = 4 PDHs

3). Author of IEEE T-CPMT and/or EPS conference paper(s) (5 PDHs) – paper must be published in IEEE Xplore within the last 5 years.

4). Reviewer for IEEE T-CPMT (3 Reviews = 5 PDH) within the last 5 years.

Once you have completed any combination of the above and received 15 PDHs, please complete the certificate form to request your Electronics Packaging Society Certificate.

Congratulations to these EPS Members on receiving the IEEE Certificate of Achievement from the IEEE Electronics Packaging Society and completing the required number of professional development hours.

Jinto George, University of Sherbrooke

Arkaprovo Das,  Simyog Technology Pvt. Ltd.

Chuan Seng Tan, Nanyang Technological University

Koushik Ramachandran, GLOBALFOUNDRIES

Jonas Zuercher, ESPROS Photonics AG

David Dahl, Hamburg University of Technology

Prof. Shashikant Patil, SVKMs NMIMS Shirpur Campus

Beth Keser, Intel

Eric Perfecto, Independent Consultant

Katsuyuki Sakuma, IBM Thomas J. Watson Research Center

Tan Yik Yee, ON Semiconductor Sdn. Bhd.

Christopher Breach, KCI UK Holdings Ltd

Stevan Hunter, ON Semiconductor, BYU-Idaho, ASU, UMD CALCE

Venkateswararao Para, Microsystems

Gan Chong Leong, Micron Technology

Venkatesh Avula, Georgia Institute of Technology

Jeff Suhling, Auburn University

Shaw Fong Wong, Intel

Siddharth Ravichandran, Georgia Institute of Technology

Omkar Gupte, Georgia Institute of Technology

Agneta Elisabet Ljungbro, Ericsson AB

Joseph Soucy, Charles Stark Draper Laboratory

Chandrasekharan Nair, Intel Corporation

Chintan Buch, Applied Materials Inc.

Atom Watanabe, Georgia Institute of Technology

Vidya Jayaram, Intel Corporation

Chris Bailey, University of Greenwich

Anil B. Lingambudi, IBM

Shuye Zhang,  Harbin Institute of Technology